MC908GZ60CFJE Freescale Semiconductor, MC908GZ60CFJE Datasheet - Page 50

IC MCU 60K FLASH 8MHZ 32-LQFP

MC908GZ60CFJE

Manufacturer Part Number
MC908GZ60CFJE
Description
IC MCU 60K FLASH 8MHZ 32-LQFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet

Specifications of MC908GZ60CFJE

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
CAN, SCI, SPI
Peripherals
LVD, POR, PWM
Number Of I /o
21
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Controller Family/series
HC08
No. Of I/o's
21
Ram Memory Size
2KB
Cpu Speed
8MHz
No. Of Timers
2
Embedded Interface Type
CAN, SCI, SPI
Rohs Compliant
Yes
Processor Series
HC08GZ
Core
HC08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
CAN, ESCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
53
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
FSICEBASE, DEMO908GZ60E, M68EML08GZE
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Memory
During the programming cycle, make sure that all addresses being written to fit within one of the ranges
specified above. Attempts to program addresses in different row ranges in one programming cycle will fail.
Use this step-by-step procedure to program a row of FLASH-1 memory.
The FLASH programming algorithm flowchart is shown in
A. Programming and erasing of FLASH locations can not be performed by code being executed from the
B. While these operations must be performed in the order shown, other unrelated operations may occur
C. It is highly recommended that interrupts be disabled during program/erase operations.
D. Do not exceed t
E. The time between each FLASH address change (step 7 to step 7), or the time between the last FLASH
F. Be cautious when programming the FLASH-1 array to ensure that non-FLASH locations are not used
50
10. Clear the PGM bit.
11. Wait for time, t
12. Clear the HVEN bit.
13. Wait for a time, t
1. Set the PGM bit in the FLASH-1 control register (FL1CR). This configures the memory for program
2. Read the FLASH-1 block protect register (FL1BPR).
3. Write to any FLASH-1 address within the row address range desired with any data.
4. Wait for time, t
5. Set the HVEN bit.
6. Wait for time, t
7. Write data byte to the FLASH-1 address to be programmed.
8. Wait for time, t
9. Repeat steps 7 and 8 until all the bytes within the row are programmed.
same FLASH array.
between the steps. However, care must be taken to ensure that these operations do not access any
address within the FLASH array memory space such as the COP control register (COPCTL) at
$FFFF.
programming time to the same row before next erase. t
address programmed to clearing the PGM bit (step 7 to step 10) must not exceed the maximum
programming time, t
as the address that is written to when selecting either the desired row address range in step 3 of the
algorithm or the byte to be programmed in step 7 of the algorithm.
operation and enables the latching of address and data programming.
t
NVS
+ t
NVH
Only bytes which are currently $FF may be programmed.
+ t
MC68HC908GZ60 • MC68HC908GZ48 • MC68HC908GZ32 Data Sheet, Rev. 6
PROG
NVS
PGS
PROG
NVH
PGS
RCV
PROG
maximum or t
(minimum 10 μs).
(minimum 5 μs).
(minimum 5 μs)
+ (t
, (typically 1 μs) after which the memory can be accessed in normal read mode.
(minimum 30 μs).
PROG X
maximum.
64)
HV
maximum. t
t
HV
maximum
NOTES
NOTE
HV
is defined as the cumulative high voltage
Figure
HV
must satisfy this condition:
2-6.
Freescale Semiconductor

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