MC912DG128AMPVE Freescale Semiconductor, MC912DG128AMPVE Datasheet - Page 455

IC MCU 128K FLASH 8MHZ 112-LQFP

MC912DG128AMPVE

Manufacturer Part Number
MC912DG128AMPVE
Description
IC MCU 128K FLASH 8MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HC12r
Datasheet

Specifications of MC912DG128AMPVE

Core Processor
CPU12
Core Size
16-Bit
Speed
8MHz
Connectivity
CAN, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x8/10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Processor Series
HC912D
Core
HC12
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
69
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (8-ch x 10-bit)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC912DG128AMPVE
Manufacturer:
FREESCALE
Quantity:
2 902
Part Number:
MC912DG128AMPVE
Manufacturer:
FREESCALE
Quantity:
800
Part Number:
MC912DG128AMPVE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC912DG128AMPVE
Manufacturer:
FREESCALE
Quantity:
800
MC68HC912DT128A — Rev 4.0
MOTOROLA
In addition to the above general pieces of advice, the following
guidelines should be followed for the CGM pins (but also more generally
for any sensitive analog circuitry):
Freescale Semiconductor, Inc.
For More Information On This Product,
Parasitic capacitance on EXTAL is absolutely critical – probably
the most critical layout consideration. The XTAL pin is not as
sensitive. All routing from the EXTAL pin through the resonator
and the blocking cap to the actual connection to VSS must be
considered.
For minimum capacitance there should ideally be no ground /
power plane around the EXTAL pin and associated routing.
However, practical EMC considerations obviously should be taken
into consideration for each application.
The clock input circuitry is sensitive to noise so excellent supply
routing and decoupling is mandatory. Connect the ground point of
the oscillator circuit directly to the VSSPLL pin.
Good isolation of PLL / Oscillator Power supply is critical. Use
1nF+ 100nF and keep tracks as low impedance as possible
Load capacitors should be low leakage and stable across
temperature – use NPO or C0G types.
The load capacitors may ‘pull’ the target frequency by a few ppm.
Crystal manufacturer specs show symmetrical values but the
series device capacitance on EXTAL and XTAL are not
symmetrical. It may be possible to adjust this by changing the
values of the load capacitors – start-up conditions should be
evaluated.
Keep the adjacent Port H / Port E and RESET signals noise free.
Don’t connect these to external signals and / or add series filtering
– a series resistor is probably adequate.
Any DC-blocking capacitor should be as low ESR as possible – for
the range of crystals we are looking at anything over 1 Ohm is too
much.
Mount oscillator components on MCU side of board – avoid using
vias in the oscillator circuitry.
Appendix: CGM Practical Aspects
Go to: www.freescale.com
Appendix: CGM Practical Aspects
Printed Circuit Board Guidelines
Technical Data
455

Related parts for MC912DG128AMPVE