MPC562MZP56 Freescale Semiconductor, MPC562MZP56 Datasheet - Page 1220

IC MPU 32BIT 56MHZ PPC 388-PBGA

MPC562MZP56

Manufacturer Part Number
MPC562MZP56
Description
IC MPU 32BIT 56MHZ PPC 388-PBGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheet

Specifications of MPC562MZP56

Core Processor
PowerPC
Core Size
32-Bit
Speed
56MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
388-BGA
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
SCI, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
56
Number Of Timers
22
Operating Supply Voltage
2.6 V to 5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 32 Channel)
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
No

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Electrical Characteristics
An estimation of the chip junction temperature, T
where:
The junction to ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. Unfortunately, the answer is only an estimate; test cases have
demonstrated that errors of a factor of two are possible. As a result, more detailed thermal characterization
is supplied.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal
resistance and a case to ambient thermal resistance:
where:
R
case to ambient thermal resistance, R
a heat sink, change the mounting arrangement on printed circuit board, or change the thermal dissipation
on the printed circuit board surrounding the device. This description is most useful for ceramic packages
with heat sinks where about 90% of the heat flow is through the case to the heat sink to ambient. For most
packages, a better model is required.
The simplest thermal model of a package which has demonstrated reasonable accuracy (about 20 percent)
is a two resistor model consisting of a junction to board and a junction to case thermal resistance. The
junction to case covers the situation where a heat sink will be used or where a substantial amount of heat
is dissipated from the top of the package. The junction to board thermal resistance describes the thermal
performance when most of the heat is conducted to the printed circuit board. It has been observed that the
thermal performance of most plastic packages and especially PBGA packages is strongly dependent on the
board. temperature.
If the board temperature is known, an estimate of the junction temperature in the environment can be made
using the following equation:
where:
F-4
θJC
is device related and cannot be influenced. The user controls the thermal environment to change the
T
T
R
P
R
R
R
R
T
T
R
P
A
D
D
J
J
B
θJA
θJA
θJA
θJC
θJA
θJB
= T
= T
= ambient temperature (°C)
= power dissipation in package
= board temperature (°C)
= power dissipation in package (
= junction to case thermal resistance (°C/W)
= package junction to board resistance (°C/W)
= package junction to ambient resistance (°C/W)
= R
= junction to ambient thermal resistance (°C/W)
= case to ambient thermal resistance (°C/W)
A
B
+ (R
+ (R
θJC
θJA
+ R
θJB
θCA
x P
x P
D
D
)
)
MPC561/MPC563 Reference Manual, Rev. 1.2
θCA
. For instance, the air flow can be changed around the device, add
)
J
, in °C can be obtained from the equation:
Freescale Semiconductor

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