MPC562MZP56 Freescale Semiconductor, MPC562MZP56 Datasheet - Page 1310

IC MPU 32BIT 56MHZ PPC 388-PBGA

MPC562MZP56

Manufacturer Part Number
MPC562MZP56
Description
IC MPU 32BIT 56MHZ PPC 388-PBGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheet

Specifications of MPC562MZP56

Core Processor
PowerPC
Core Size
32-Bit
Speed
56MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
388-BGA
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
SCI, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
56
Number Of Timers
22
Operating Supply Voltage
2.6 V to 5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 32 Channel)
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
No

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66-MHz Electrical Characteristics
An estimation of the chip junction temperature, T
where:
The junction to ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. Unfortunately, the answer is only an estimate; test cases have
demonstrated that errors of a factor of two are possible. As a result, more detailed thermal characterization
is supplied.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal
resistance and a case to ambient thermal resistance:
where:
G-4
1
2
3
4
5
6
7
8
BGA Package Thermal Resistance,
Junction to Board
BGA Package Thermal Resistance,
Junction to Case (top)
BGA Package Thermal Resistance,
Junction to Package Top, Natural Convection
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per SEMI G38-87 and JESD51-2 with the board horizontal.
These values are the mean + 3 standard deviations of characterized data.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board (Four layer (2s2p) board, natural convection).
Indicates the thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per EIA/JESD51-2.
T
T
R
P
R
R
R
R
A
D
J
θJA
θJA
θJA
θJC
θJA
= T
= ambient temperature (°C)
= power dissipation in package
= junction to case thermal resistance (°C/W)
= package junction to ambient resistance (°C/W)
= R
= junction to ambient thermal resistance (°C/W)
= case to ambient thermal resistance (°C/W)
A
+ (R
θJC
Characteristic
θJA
+ R
θCA
x P
Table G-2. Thermal Characteristics (continued)
D
)
MPC561/MPC563 Reference Manual, Rev. 1.2
J
, in °C can be obtained from the equation:
Symbol
R
R
Ψ
θJB
θJT
JT
21.2
Value
7.0
1.6
3,7
8
3,6
Freescale Semiconductor
°C/W
°C/W
°C/W
Unit

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