TLP281-4 Toshiba, TLP281-4 Datasheet
TLP281-4
Specifications of TLP281-4
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TLP281-4 Summary of contents
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... TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR Programmable Controllers Power Supplies Hybrid ICs The Toshiba TLP285-4 consists of photo transistor, optically coupled to a gallium arsenide infrared emitting diode. TLP285-4 is housed in the SOP16 package, very small and thin coupler. Since TLP285-4 are guaranteed wide operating temperature (Ta=-55 to 110 ˚ ...
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Current Transfer Ratio Classification TYPE I (Note1) F Blank TLP285-4 Rank GB Note1: ex. Rank GB: TLP285 (GB) Application type name for certification test, please use standard product type name, i.e. TLP285−4 (GB): TLP285-4 Current Transfer Ratio (%) (I / ...
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... Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). ...
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Coupled Electrical Characteristics CHARACTERISTIC Current Transfer Ratio Saturated CTR Collector-Emitter Saturation Voltage Off-State Collector Current Isolation Characteristics CHARACTERISTIC Capacitance (Input to Output) Isolation Resistance Isolation Voltage Switching Characteristics CHARACTERISTIC Rise Time Fall Time Turn-On Time Turn-Off Time Turn-On Time Storage ...
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100 - Ambient temperature Ta (˚ 3000 1000 500 300 100 Duty cycle ...
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Collector-emitter voltage 100 10 ...
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0.28 0.24 0.2 0.16 0.12 0.08 0.04 0 -40 - Ambient temperature Ta (℃ ...
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Soldering and Storage 1. Soldering 1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) Using solder reflow ·Temperature profile example ...
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Storage 1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity ...
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Option:Specification for Embossed-Tape Packing (TP) for Mini-Flat Coupler 1. Applicable Package 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP285-4(GB-TP,F ...
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Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2. 0.3 ± 0.05 φ1 2.4 ± 0.2 Symbol Dimension ...
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... TLP285-4(GB-TP,F) 2500 Pcs Note6 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. ...
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... Specifications for EN60747-5-2 option: (V4) Types : TLP285-4 Type designations for “option: (V4)”, which are tested under EN60747 requirements. Ex.: TLP285-4 (V4GB-TP,F Note: Use TOSHIBA standard type number for safety standard application. Ex.: TLP285-4 (V4GB-TP,F → TLP285-4 EN60747 Isolation Characteristics Application classification for rated mains voltage ≤ 150Vrms for rated mains voltage ≤ ...
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Insulation Related Specifications Minimum creepage distance Minimum clearance Minimum insulation thickness Comparative tracking index printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e. standard distance between soldering eye ...
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Partial discharge measurement procedure according to EN60747 Figure Destructive test for qualification and sampling tests. Method A (for type and sampling tests, destructive tests ...
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... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ...