WG82574L S LBA8 Intel, WG82574L S LBA8 Datasheet - Page 454
WG82574L S LBA8
Manufacturer Part Number
WG82574L S LBA8
Description
Manufacturer
Intel
Datasheet
1.WG82574L_S_LBA8.pdf
(472 pages)
Specifications of WG82574L S LBA8
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
64
Lead Free Status / RoHS Status
Compliant
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Note:
14.7
Table 93.
14.7.1
14.7.2
454
1. Tcase is defined as the maximum case temperature without any thermal enhancement to the package.
The thermal parameters listed in
assembled on a 4-layer 30 x 56 mm mini PCIe board connected to a system board in a
natural convection environment. The maximum case temperature is based on the
maximum junction temperature and defined by the relationship, Tcase-max = Tjmax -
(JT x Power) where JT is the junction-to-package top thermal characterization
parameter. If the case temperature exceeds the specified Tcase max, thermal
enhancements such as heat sinks or forced air are required. JA is the package junction-
to-air thermal resistance.
Thermal models are available upon request (Flotherm 2-Resistor, Delphi or Detailed
format).
Thermal Specifications
To ensure proper operation and reliability of the 82574, the thermal solution must
maintain a case temperature at or below the values specified in
or component-level thermal enhancements are required to dissipate the generated heat
if the case temperature exceeds the maximum temperatures listed in
Good system airflow is critical to dissipate the highest possible thermal power. The size
and number of fans, vents, and/or ducts, and, their placement in relation to
components and airflow channels within the system determine airflow. Acoustic noise
constraints might limit the size and types of fans, vents and ducts that can be used in a
particular design.
To develop a reliable, cost-effective thermal solution, all of the system variables must
be considered. Use system-level thermal characteristics and simulations to account for
individual component thermal requirements.
82574 Preliminary Thermal Absolute Maximum Rating
Case Temperature
The 82574 is designed to operate properly as long as the Tcase is not exceeded.
Section 14.12
Designing for Thermal Performance
Section 14.14
achieve the required 82574 thermal performance.
Parameter
Tcase
describes the proper guidelines for measuring case temperature.
describes the PCB and system design recommendations required to
1
Table 92
82574 GbE Controller—Thermal Design Considerations
are based on simulated results of packages
Maximum
109 °C
Table
93. System-level
Table
93.
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