PCF8531U NXP [NXP Semiconductors], PCF8531U Datasheet - Page 5
PCF8531U
Manufacturer Part Number
PCF8531U
Description
34 x 128 pixel matrix driver
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.PCF8531U.pdf
(44 pages)
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NXP Semiconductors
PCF8531_4
Product data sheet
6.2 Pin description
Table 4.
[1]
[2]
Table 5.
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see
Pad
Pad pitch
Bump dimensions
Wafer thickness (excluding bumps)
Die size L
Symbol
-
-
-
-
-
-
-
-
-
-
-
-
-
-
OSC
Fig 4.
Fab 1
Fab 2
Fab 1 identification starts with nnnnnn, where n represents a number between 0 and 9.
Fab 2 identification starts with AXnnnn, where X represents a letter and n represents a number between 0
and 9.
[1]
[2]
Chip dimensions
Bonding pad dimensions
Bonding pad description
W
Pad
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Figure
Rev. 04 — 13 June 2008
W
X ( m)
5973.6
5969.5
5899.5
5829.5
5479.5
5409.5
5059.5
4989.5
4639.5
4569.5
4219.5
4149.5
3799.5
3729.5
3449.5
Y
2).
X
Y ( m)
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
821.7
PCF8531
L
Description
dummy
oscillator input
Size
70
50
381
12.23
12.14
pitch
90
1.96
1.86
001aag908
17.5 ( 3)
34 x 128 pixel matrix driver
PCF8531
© NXP B.V. 2008. All rights reserved.
Unit
mm
mm
m
m
m
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