LM2672MX-12 NSC [National Semiconductor], LM2672MX-12 Datasheet - Page 22
LM2672MX-12
Manufacturer Part Number
LM2672MX-12
Description
Manufacturer
NSC [National Semiconductor]
Datasheet
1.LM2672MX-12.pdf
(25 pages)
- Current page: 22 of 25
- Download datasheet (476Kb)
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Application Information
LLP Package Devices
The LM2672 is offered in the 16 lead LLP surface mount
package to allow for increased power dissipation compared
to the SO-8 and DIP. For details on thermal performance as
(Continued)
22
well as mounting and soldering specifications, refer to Appli-
cation Note AN-1187.
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