PESD3V3S2UT,215 NXP Semiconductors, PESD3V3S2UT,215 Datasheet - Page 10

DIODE DBL ESD PROTECTION SOT23

PESD3V3S2UT,215

Manufacturer Part Number
PESD3V3S2UT,215
Description
DIODE DBL ESD PROTECTION SOT23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PESD3V3S2UT,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Reverse Standoff (typ)
3.3V
Voltage - Breakdown
5.2V
Power (watts)
330W
Polarization
2 Channel Array - Unidirectional
Mounting Type
Surface Mount
Polarity
Unidirectional
Clamping Voltage
7 V
Operating Voltage
3.3 V
Breakdown Voltage
5.6 V
Termination Style
SMD/SMT
Peak Surge Current
18 A
Peak Pulse Power Dissipation
330 W
Capacitance
207 pF
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Dimensions
1.4 mm W x 3 mm L x 1.1 mm H
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4046-2
934058196215
PESD3V3S2UT T/R
PESD3V3S2UT T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PESD3V3S2UT,215
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
APPLICATION INFORMATION
The PESDxS2UT series is designed for uni-directional protection for up to two lines against damage caused by
ElectroStatic Discharge (ESD) and surge pulses. The PESDxS2UT series may be used on lines where the signal
polarities are below ground. PESDxS2UT series provide a surge capability of up to 330 W (P
waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The
following guidelines are recommended:
• Place the PESDxS2UT as close as possible to the input terminal or connector.
• The path length between the PESDxS2UT and the protected line should be minimized.
• Keep parallel signal paths to a minimum.
• Avoid running protected conductors in parallel with unprotected conductors.
• Minimize all printed-circuit board conductive loops including power and ground loops.
• Minimize the length of transient return paths to ground.
• Avoid using shared return paths to a common ground point.
• Ground planes should be used whenever possible. For multilayer printed-circuit boards use ground vias.
2004 Apr 15
Double ESD protection diodes in SOT23
package
Fig.10 Typical application: ESD protection of data lines.
unidirectional protection
of two lines
line 1 to be protected
line 2 to be protected
PESDxS2UT
ground
10
bidirectional protection
of one line
PESDxS2UT
line 1 to be protected
ground
001aaa491
PESDxS2UT series
pp
) per line for an 8/20 µs
Product data sheet

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