F0402E1R00FSTR AVX Corporation, F0402E1R00FSTR Datasheet - Page 29

FUSE 1.00A 32V FAST THIN 0402

F0402E1R00FSTR

Manufacturer Part Number
F0402E1R00FSTR
Description
FUSE 1.00A 32V FAST THIN 0402
Manufacturer
AVX Corporation
Series
Accu-Guard®r
Type
SMD Thin Film Fuser
Datasheets

Specifications of F0402E1R00FSTR

Fuse Type
Fast Acting
Voltage - Rated
32VDC
Current
1A
Package / Case
0402 (1005 Metric)
Size / Dimension
0.040" L x 0.020" W x 0.016" H (1.00mm x 0.50mm x 0.40mm)
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 125°C
Dc Cold Resistance
0.13 Ohm
Melting I²t
0.008
Current Rating
1 Amp
Voltage Rating
32 Volts
Fuse Size / Group
0402
Termination Style
SMD/SMT
Dimensions
1 mm L x 0.55 mm W
Product
Surface Mount Fuse
Interrupt Rating
50 Amps
Mounting Style
SMD/SMT
Operating Temperature Range
- 55 C to + 125 C
Voltage Rating Vac
32V
Voltage Rating Vdc
32V
Fuse Current
1A
Breaking Capacity
50A @ 32V
Blow Characteristic
Fast Acting
Fuse Case Style
0402
Fuse Terminals
SMD Caps
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Color
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
478-2855-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
F0402E1R00FSTR
Manufacturer:
AVX
Quantity:
60 000
215°C
220
210
200
190
180
170
160
150
140
130
120
110
100
260
240
220
200
180
160
140
120
100
200
180
160
140
120
100
90
80
70
60
50
40
30
20
80
60
40
20
80
60
40
20
0
0
Assembly enters the
preheat zone
0
10
0.5
Preheat
20
1
Soak time
1) Activates the flux
2) Allows center of board
temperatures to catch up with
corners
30
100°C
Additional soak time
to allow uniform
heating of the
substrate
1.5
40
2
50
Time (minutes)
Time (mins)
2.5
60
Time (seconds)
70
45-60 sec.
above solder
melting point
3
80
3.5
90
Assembly exits heat–
no forced cooldown
4
186°C solder melting
temperature
100
Enter Wave
3–5 seconds
110
4.5
120
Natural
Cooling
Transfer from
preheat with
min. delay &
temp. loss
215°C
200
180
160
140
120
100
80
60
40
20
0
Enter
Vapor
Duration varies
with thermal mass
of assembly
10–60 secs typical
10
Reflow
20
30
Time (seconds)
40
50
Natural
Cooling
60
70

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