PIC18F26K20-E/SP Microchip Technology, PIC18F26K20-E/SP Datasheet - Page 342
![IC PIC MCU FLASH 32KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F26K20-E/SP
Manufacturer Part Number
PIC18F26K20-E/SP
Description
IC PIC MCU FLASH 32KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(456 pages)
3.PIC18F26K20-ISS.pdf
(6 pages)
4.PIC18F26K20-ISS.pdf
(10 pages)
5.PIC18F26K20-ISO.pdf
(430 pages)
Specifications of PIC18F26K20-E/SP
Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
CCP, ECCP, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
64 MHz
Operating Supply Voltage
2.5|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC18F25K20T-ISS PDF datasheet
- PIC18F25K20T-ISS PDF datasheet #2
- PIC18F26K20-ISS PDF datasheet #3
- PIC18F26K20-ISS PDF datasheet #4
- PIC18F26K20-ISO PDF datasheet #5
- Current page: 342 of 430
- Download datasheet (7Mb)
PIC18F2XK20/4XK20
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS41303D-page 340
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)
TOS
PC
Q1
operation
Pop Top of Return Stack
POP
None
(TOS) → bit bucket
None
The TOS value is pulled off the return
stack and is discarded. The TOS value
then becomes the previous value that
was pushed onto the return stack.
This instruction is provided to enable
the user to properly manage the return
stack to incorporate a software stack.
1
1
POP
GOTO
0000
Q2
No
0000
NEW
POP TOS
=
=
=
=
value
Q3
0031A2h
014332h
014332h
NEW
0000
operation
Q4
No
0110
Preliminary
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PC + 2 onto
return stack
Push Top of Return Stack
PUSH
None
(PC + 2) → TOS
None
The PC + 2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows implementing a
software stack by modifying TOS and
then pushing it onto the return stack.
1
1
PUSH
PUSH
0000
Q2
© 2008 Microchip Technology Inc.
0000
operation
=
=
=
=
=
Q3
No
345Ah
0126h
345Ah
0124h
0126h
0000
operation
Q4
No
0101
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