PIC18F26K20-E/SP Microchip Technology, PIC18F26K20-E/SP Datasheet - Page 384
![IC PIC MCU FLASH 32KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F26K20-E/SP
Manufacturer Part Number
PIC18F26K20-E/SP
Description
IC PIC MCU FLASH 32KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(456 pages)
3.PIC18F26K20-ISS.pdf
(6 pages)
4.PIC18F26K20-ISS.pdf
(10 pages)
5.PIC18F26K20-ISO.pdf
(430 pages)
Specifications of PIC18F26K20-E/SP
Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
CCP, ECCP, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
64 MHz
Operating Supply Voltage
2.5|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC18F25K20T-ISS PDF datasheet
- PIC18F25K20T-ISS PDF datasheet #2
- PIC18F26K20-ISS PDF datasheet #3
- PIC18F26K20-ISS PDF datasheet #4
- PIC18F26K20-ISO PDF datasheet #5
- Current page: 384 of 430
- Download datasheet (7Mb)
PIC18F2XK20/4XK20
FIGURE 26-6:
TABLE 26-9:
DS41303D-page 382
10
11
12
13
14
15
16
17
18
19
20
21
22†
23†
Note 1:
Param
No.
CLKOUT
(Output)
I/O pin
I/O pin
(Input)
OSC1
Note:
† These parameters are asynchronous events not related to any internal clock edges.
TosH2ckL OSC1 ↑ to CLKOUT ↓
TosH2ckH OSC1 ↑ to CLKOUT ↑
TckR
TckF
TckL2ioV
TioV2ckH Port In Valid before CLKOUT ↑
TckH2ioI
TosH2ioV OSC1 ↑ (Q1 cycle) to Port Out Valid
TosH2ioI
TioV2osH Port Input Valid to OSC1 ↑ (I/O in setup time)
TioR
TioF
T
T
Symbol
INP
RBP
Measurements are taken in RC mode, where CLKOUT output is 4 x T
Refer to Figure 26-4 for load conditions.
CLKOUT AND I/O TIMING REQUIREMENTS
CLKOUT Rise Time
CLKOUT Fall Time
CLKOUT ↓ to Port Out Valid
Port In Hold after CLKOUT ↑
OSC1 ↑ (Q2 cycle) to Port Input Invalid
(I/O in hold time)
Port Output Rise Time
Port Output Fall Time
INTx pin High or Low Time
RB<7:4> Change KBIx High or Low Time
Old Value
CLKOUT AND I/O TIMING
Q4
Characteristic
10
13
17
14
20, 21
Preliminary
Q1
19
0.25 T
18
Min
100
T
20
—
—
—
—
—
—
—
—
CY
0
0
CY
+ 25
Q2
15
Typ
OSC
75
75
35
35
—
—
—
50
—
—
10
10
—
—
.
0.5 T
© 2008 Microchip Technology Inc.
Max
200
200
100
100
150
CY
25
25
—
—
—
—
—
—
11
12
+ 20
New Value
16
Units Conditions
Q3
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
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