T89C51CC02CA-TDSIM Atmel, T89C51CC02CA-TDSIM Datasheet - Page 27

IC 8051 MCU FLASH 16K 24SOIC

T89C51CC02CA-TDSIM

Manufacturer Part Number
T89C51CC02CA-TDSIM
Description
IC 8051 MCU FLASH 16K 24SOIC
Manufacturer
Atmel
Series
AT89C CANr

Specifications of T89C51CC02CA-TDSIM

Core Processor
8051
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
20
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
24-SOIC (7.5mm Width)
For Use With
AT89STK-06 - KIT DEMOBOARD 8051 MCU W/CAN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
T89C51CC02CATDSIM
Upper 128 Bytes RAM
Expanded RAM
4126L–CAN–01/08
Figure 10. Lower 128 Bytes Internal RAM Organization
The upper 128 Bytes of RAM are accessible from address 80h to FFh using only indirect
addressing mode.
The on-chip 256 Bytes of expanded RAM (XRAM) are accessible from address 0000h to
00FFh using indirect addressing mode through MOVX instructions. In this address
range.
Note:
Lower 128 Bytes RAM, Upper 128 Bytes RAM, and expanded RAM are made of volatile
memory cells. This means that the RAM content is indeterminate after power-up and
must then be initialized properly.
30h
20h
18h
10h
08h
00h
7Fh
2Fh
1Fh
17h
0Fh
07h
bit-Addressable Space
(bit Addresses 0-7Fh)
4 Banks of
8 Registers
R0-R7
AT/T89C51CC02
27

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