PIC18LF452-I/P Microchip Technology, PIC18LF452-I/P Datasheet - Page 242
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PIC18LF452-I/P
Manufacturer Part Number
PIC18LF452-I/P
Description
IC MCU FLASH 16KX16 A/D 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F242-ISO.pdf
(332 pages)
3.PIC18F242-ISO.pdf
(14 pages)
4.PIC18F242-ISO.pdf
(16 pages)
5.PIC18F242-ISO.pdf
(16 pages)
6.PIC18F242-ISO.pdf
(14 pages)
7.PIC18LF242-ISO.pdf
(36 pages)
Specifications of PIC18LF452-I/P
Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
34
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC18
No. Of I/o's
34
Eeprom Memory Size
256Byte
Ram Memory Size
1.5KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
MSSP, SPI, I2C, PSP, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
34
Number Of Timers
1 x 16 bit
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF452-I/P
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
PIC18LF452-I/PT
Manufacturer:
XILINX
Quantity:
349
Company:
Part Number:
PIC18LF452-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18LF452-I/PT
Manufacturer:
MICROCH
Quantity:
20 000
PIC18FXX2
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS39564C-page 240
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)
TOS
PC
Q1
operation
Pop Top of Return Stack
[ label ]
None
(TOS)
None
The TOS value is pulled off the
return stack and is discarded. The
TOS value then becomes the previ-
ous value that was pushed onto the
return stack.
This instruction is provided to
enable the user to properly manage
the return stack to incorporate a
software stack.
1
1
POP
GOTO
0000
No
Q2
bit bucket
POP
0000
NEW
POP TOS
=
=
=
=
value
Q3
0031A2h
014332h
014332h
NEW
0000
operation
No
Q4
0110
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PUSH PC+2
onto return
Push Top of Return Stack
[ label ]
None
(PC+2)
None
The PC+2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows to implement
a software stack by modifying TOS,
and then push it onto the return
stack.
1
1
PUSH
stack
0000
Q2
© 2006 Microchip Technology Inc.
PUSH
TOS
0000
operation
=
=
=
=
=
No
Q3
00345Ah
000124h
000126h
000126h
00345Ah
0000
operation
No
Q4
0101