PIC18F6680-I/PT Microchip Technology, PIC18F6680-I/PT Datasheet - Page 468
PIC18F6680-I/PT
Manufacturer Part Number
PIC18F6680-I/PT
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PCM18XK1.pdf
(496 pages)
3.PIC18F6585-IPT.pdf
(8 pages)
4.PIC18F6585-IPT.pdf
(38 pages)
5.PIC18F6585-IPT.pdf
(14 pages)
Specifications of PIC18F6680-I/PT
Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
I2C/SPI/AUSART/CAN
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F6680-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PCM18XK1 PDF datasheet #2
- PIC18F6585-IPT PDF datasheet #3
- PIC18F6585-IPT PDF datasheet #4
- PIC18F6585-IPT PDF datasheet #5
- Current page: 468 of 496
- Download datasheet (9Mb)
PIC18F6585/8585/6680/8680
29.2
The following sections give the technical details of the packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS30491C-page 466
Package Details
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
CH
(F)
D1
A2
A1
E1
n1
E
D
B
n
p
A
L
c
L
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
D1
0
5
5
CH x 45
INCHES
D
NOM
A1
.020
.043
.039
.006
.024
.039
.472
.472
.394
.394
.007
.009
.035
3.5
64
16
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
MILLIMETERS*
0
5
5
2004 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
1.00
0.18
0.22
0.89
3.5
64
16
10
10
MAX
12.25
12.25
10.10
10.10
A2
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7
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