LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 302
LPC2478FBD208,551
Manufacturer Part Number
LPC2478FBD208,551
Description
IC ARM7 MCU 512K LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(91 pages)
2.OM11077.pdf
(792 pages)
3.OM11077.pdf
(10 pages)
4.LPC2478FBD208551.pdf
(89 pages)
Specifications of LPC2478FBD208,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
Development Tools By Supplier
OM11015, OM11019, OM11022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4363
935284069551
LPC2478FBD208-S
935284069551
LPC2478FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2478FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC2478FBD208,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
- OM11077 PDF datasheet
- OM11077 PDF datasheet #2
- OM11077 PDF datasheet #3
- LPC2478FBD208551 PDF datasheet #4
- Current page: 302 of 792
- Download datasheet (5Mb)
NXP Semiconductors
UM10237_4
User manual
6.12 LCD power-up and power-down sequence
The LCD controller requires the following power-up sequence to be performed:
1. When power is applied, the following signals are held LOW:
2. When LCD power is stabilized, a 1 is written to the LcdEn bit in the LCD_CTRL register.
This enables the following signals into their active states:
The LCDV[23:0] signals remain in an inactive state.
3. When the signals in step 2 have stabilized, the contrast voltage (not controlled or
supplied by the LCD controller) is applied to the LCD panel.
4. If required, a software or hardware timer can be used to provide the minimum display
specific delay time between application of the control signals and power to the panel
display. On completion of the time interval, power is applied to the panel by writing a 1 to
the LcdPwr bit within the LCD_CTRL register that, in turn, sets the LCDPWR signal high
and enables the LCDV[23:0] signals into their active states. The LCDPWR signal is
intended to be used to gate the power to the LCD panel.
The power-down sequence is the reverse of the above four steps and must be strictly
followed, this time, writing the respective register bits with 0.
Figure 12–40
•
•
•
•
•
•
•
•
•
•
•
LCDLP
LCDDCLK
LCDFP
LCDENAB/ LCDM
LCDVD[23:0]
LCDLE
LCDLP
LCDDCLK
LCDFP
LCDENAB/ LCDM
LCDLE
shows the power-up and power-down sequences.
Rev. 04 — 26 August 2009
Chapter 12: LPC24XX LCD controller
UM10237
© NXP B.V. 2009. All rights reserved.
302 of 792
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