ST72F63BD6U1TR STMicroelectronics, ST72F63BD6U1TR Datasheet - Page 171
![MCU 8BIT LS USB 32KB FLSH 40-QFN](/photos/12/14/121423/497-40-qfn_series_sml.jpg)
ST72F63BD6U1TR
Manufacturer Part Number
ST72F63BD6U1TR
Description
MCU 8BIT LS USB 32KB FLSH 40-QFN
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST72F63BD6U1TR.pdf
(186 pages)
Specifications of ST72F63BD6U1TR
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SCI, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
27
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
40-QFN
Processor Series
ST72F6x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SCI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
27
Number Of Timers
1
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7MDTU3-EPB/US, ST72F63B-SK/RAIS, ST7MDTU3-EMU3, STX-RLINK
Minimum Operating Temperature
0 C
On-chip Adc
8 bit, 8 Channel / 8 bit, 12 Channel
For Use With
497-5521 - EVAL BOARD LOW SPEED USB497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-5623
497-5623-2
497-5623
ST72F63BD6U1
497-5623-2
497-5623
ST72F63BD6U1
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
- Current page: 171 of 186
- Download datasheet (3Mb)
ST7263Bxx
14.2
14.3
Thermal characteristics
Table 85.
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Soldering and glueability information
Recommended glue for SMD plastic packages dedicated to molding compound with
silicone:
●
●
of an application can be defined by the user with the formula: P
internal power (I
application.
Heraeus: PD945, PD955
Loctite: 3615, 3298
Symbol
T
R
P
Jmax
thJA
D
Thermal characteristics
DD
x V
Package thermal resistance (junction to
ambient)
SDIP32
LQFP48
QFN40
Power dissipation
Maximum junction temperature
SO34
SO24
DD
) and P
PORT
Doc ID 7516 Rev 8
the port power dissipation depending on the ports used in the
(1)
Ratings
(2)
D
D
=P
= (T
INT
J
-T
+ P
A
) / R
PORT
Package characteristics
thJA
where P
. The power dissipation
Value
500
150
60
75
70
80
34
INT
is the chip
°C/W
171/186
Unit
mW
°C
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