C8051F321-GM Silicon Laboratories Inc, C8051F321-GM Datasheet - Page 35

• Manufacturer Part Number: C8051F321-GM
• Description: IC 8051 MCU 16K FLASH 28MLP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F32xr

Specifications of C8051F321-GM

• Program Memory Type: FLASH
• Program Memory Size: 16KB (16K x 8)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 21
• Ram Size: 2.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 2.25 KB
• Interface Type: I2C/SMBus/SPI/UART/USB
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F320DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 13-ch x 10-bit or 17-ch x 10-bit
• No. Of I/o's: 21
• Ram Memory Size: 1280Byte
• Cpu Speed: 25MHz
• No. Of Timers: 4
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1480 - DAUGHTER CARD TOOLSTCK C8051F321770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1449 - ADAPTER PROGRAM TOOLSTICK F321336-1260 - DEV KIT FOR C8051F320/F321
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1261

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
5. The stencil thickness should be 0.125mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
C1
C2
E
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
Body Components.
Figure 4.3. LQFP-32 Recommended PCB Land Pattern
Table 4.3. LQFP-32 PCB Land Pattern Dimensions
8.40
8.40
Min
0.80
Max
8.50
8.50
Rev. 1.4
Dimension
X1
Y1
0.40
1.25
Min
C8051F320/1
Max
0.50
1.35
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