MC9S12E128CPVE Freescale Semiconductor, MC9S12E128CPVE Datasheet - Page 503

• Manufacturer Part Number: MC9S12E128CPVE
• Description: IC MCU 128K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E128CPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: S12E
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 92
• Number Of Timers: 12
• Operating Supply Voltage: 3.135 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• On-chip Dac: 2-ch x 8-bit
• Controller Family/series: HCS12/S12X
• No. Of I/o's: 90
• Ram Memory Size: 8KB
• Cpu Speed: 25MHz
• No. Of Timers: 4
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

16.4.3.2
A breakpoint request to the CPU can be created if BKCEN in DBGC2 is set. Breakpoints based on a
successful comparator C match can be accomplished regardless of the mode of operation for comparator
A or B, and do not affect the status of the ARM bit. TAGC in DBGC2 is used to select either tagged or
forced breakpoint requests for comparator C. Breakpoints based on comparator C are disabled in LOOP1
mode.
16.5
The DBG module is disabled after reset.
The DBG module cannot cause a MCU reset.
16.6
The DBG contains one interrupt source. If a breakpoint is requested and BDM in DBGC2 is cleared, an
SWI interrupt will be generated.
Freescale Semiconductor
BEGIN
Resets
Interrupts
0
0
0
0
1
1
1
1
Breakpoint Based on Comparator C
Because breakpoints cannot be disabled when the DBG is armed, one must
be careful to avoid an “infinite breakpoint loop” when using tagged-type C
breakpoints while the DBG is armed. If BDM breakpoints are selected,
executing a TRACE1 instruction before the GO instruction is the
recommended way to avoid re-triggering a breakpoint if one does not wish
to de-arm the DBG. If SWI breakpoints are selected, disarming the DBG in
the SWI interrupt service routine is the recommended way to avoid
re-triggering a breakpoint.
TRGSEL
0
0
1
1
0
0
1
1
DBGBRK
MC9S12E128 Data Sheet, Rev. 1.07
Table 16-26. Breakpoint Setup
0
1
0
1
0
1
0
1
Fill trace buffer until trigger address
(no CPU breakpoint — keep running)
Fill trace buffer until trigger address, then a forced breakpoint
request occurs
Fill trace buffer until trigger opcode is about to execute
(no CPU breakpoint — keep running)
Fill trace buffer until trigger opcode about to execute, then a
tagged breakpoint request occurs
Start trace buffer at trigger address
(no CPU breakpoint — keep running)
Start trace buffer at trigger address, a forced breakpoint
request occurs when trace buffer is full
Start trace buffer at trigger opcode
(no CPU breakpoint — keep running)
Start trace buffer at trigger opcode, a forced breakpoint request
occurs when trace buffer is full
NOTE
Type of Debug Run
Chapter 16 Debug Module (DBGV1)
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