MC9S12E128CPVE Freescale Semiconductor, MC9S12E128CPVE Datasheet - Page 567

• Manufacturer Part Number: MC9S12E128CPVE
• Description: IC MCU 128K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E128CPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: S12E
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 92
• Number Of Timers: 12
• Operating Supply Voltage: 3.135 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• On-chip Dac: 2-ch x 8-bit
• Controller Family/series: HCS12/S12X
• No. Of I/o's: 90
• Ram Memory Size: 8KB
• Cpu Speed: 25MHz
• No. Of Timers: 4
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

A.1.7
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
1
2
A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
The total power dissipation can be calculated from:
Freescale Semiconductor
I/O, Regulator and Analog Supply Voltage
Internal Logic Supply Voltage
PLL Supply Voltage
Voltage Difference VDDX to VDDA
Voltage Difference VSSX to VSSR and VSSA
Oscillator
Bus Frequency
Operating Junction Temperature Range
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The given
operating range applies when this regulator is disabled and the device is powered from an external source.
Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper operation.
T
T
T
P
P
P
J
J
A
D
JA
D
INT
=
=
=
=
=
=
T
Junction Temperature, [ C
Ambient Temperature, [ C
Total Chip Power Dissipation, [W]
=
P
A
Package Thermal Resistance, [ C/W]
INT
Operating Conditions
Power Dissipation and Thermal Characteristics
Chip Internal Power Dissipation, [W]
+
2
Instead of specifying ambient temperature all parameters are specified for
the more meaningful silicon junction temperature. For power dissipation
calculations refer to
Characteristics”.
P
+
D
1
P
IO
JA
Rating
1
Section A.1.8, “Power Dissipation and Thermal
Table A-4. Operating Conditions
MC9S12E128 Data Sheet, Rev. 1.07
NOTE
Symbol
V
V
V
DDPLL
VDDX
VSSX
f
f
DD5
osc
bus
T
DD
J
2.97
2.35
2.35
–0.1
–0.1
0.25
Min
–40
0.5
Appendix A Electrical Characteristics
3.3/5
Typ
2.5
2.5
—
—
—
0
0
Max
2.75
2.75
140
J
5.5
0.1
0.1
16
25
) in C can be
MHz
MHz
Unit
V
V
V
V
V
C
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