MC9S12E128CPVE Freescale Semiconductor, MC9S12E128CPVE Datasheet - Page 582

• Manufacturer Part Number: MC9S12E128CPVE
• Description: IC MCU 128K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E128CPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: S12E
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 92
• Number Of Timers: 12
• Operating Supply Voltage: 3.135 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• On-chip Dac: 2-ch x 8-bit
• Controller Family/series: HCS12/S12X
• No. Of I/o's: 90
• Ram Memory Size: 8KB
• Cpu Speed: 25MHz
• No. Of Timers: 4
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
A.4.1.4
Erasing a NVM block takes:
The setup times can be ignored for this operation.
A.4.1.5
The time it takes to perform a blank check on the Flash is dependant on the location of the first non-blank
word starting at relative address zero. It takes one bus cycle per word to verify plus a setup of the command.
1
2
3
4
5
6
7
582
Conditions are shown in
Num
Restrictions for oscillator in crystal mode apply!
Minimum Programming times are achieved under maximum NVM operating frequency f
f
Maximum Erase and Programming times are achieved under particular combinations of f
Refer to formulae in Sections A.3.1.1 - A.3.1.4 for guidance.
Minimum Erase times are achieved under maximum NVM operating frequency f
Minimum time, if first word in the array is not blank
Maximum time to complete check on an erased block
Where t
bus
1
2
3
4
5
6
7
8
9
.
cyc
C
D
D
D
D
D
D
P
P
P
is the system bus clock period.
External Oscillator Clock
Bus frequency for Programming or Erase Operations
Operating Frequency
Single Word Programming Time
Flash Burst Programming consecutive word
Flash Burst Programming Time for 64 Word row
Sector Erase Time
Mass Erase Time
Blank Check Time Flash per block
Mass Erase
Blank Check
Table A-4
unless otherwise noted
Rating
Table A-14. NVM Timing Characteristics
MC9S12E128 Data Sheet, Rev. 1.07
t
check
t
mass
location t
20000
cyc
------------------------ -
f
NVMOP
+
f
f
Symbol
1
NVMOSC
NVMBUS
f
t
t
NVMOP
t
t
10 t
swpgm
bwpgm
t
brpgm
mass
check
t
era
cyc
NVMOP
1331.2
20.4
100
Min
150
46
20
11
0.5
.
1
NVMOP
2
4
5
4
2
NVMOP
2
and maximum bus frequency
Typ
—
—
—
—
—
—
—
—
—
and bus frequency f bus.
Freescale Semiconductor
2027.5
65546
74.5
26.7
133
Max
50
200
31
1
3
3
3
3
6
3
7
MHz
MHz
Unit
kHz
ms
ms
t
cyc
s
s
s