MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 115

IC MCU 256K FLASH 80-QFP

MC9S12XDT256CAA

Manufacturer Part Number
MC9S12XDT256CAA
Description
IC MCU 256K FLASH 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XDT256CAA

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
59
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
S12XD
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
59
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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2.5.2
The CRG generates a clock monitor reset in case all of the following conditions are true:
The reset event asynchronously forces the configuration registers to their default settings (see
“Memory Map and Register
doesn’t change the state of the CME bit, because it has already been set). As a consequence the CRG
immediately enters self clock mode and starts its internal reset sequence. In parallel the clock quality check
starts. As soon as clock quality check indicates a valid oscillator clock the CRG switches to OSCCLK and
leaves self clock mode. Since the clock quality checker is running in parallel to the reset generator, the
CRG may leave self clock mode while still completing the internal reset sequence. When the reset
sequence is finished, the CRG checks the internally latched state of the clock monitor fail circuit. If a clock
monitor fail is indicated, processing begins by fetching the clock monitor reset vector.
2.5.3
When COP is enabled, the CRG expects sequential write of 0x_55 and 0x_AA (in this order) to the
ARMCOP register during the selected time-out period. Once this is done, the COP time-out period restarts.
If the program fails to do this the CRG will generate a reset. Also, if any value other than 0x_55 or 0x_AA
is written, the CRG immediately generates a reset. In case windowed COP operation is enabled writes
(0x_55 or 0x_AA) to the ARMCOP register must occur in the last 25% of the selected time-out period. A
premature write the CRG will immediately generate a reset.
As soon as the reset sequence is completed the reset generator checks the reset condition. If no clock
monitor failure is indicated and the latched state of the COP timeout is true, processing begins by fetching
the COP vector.
2.5.4
The on-chip voltage regulator detects when V
on reset or low voltage reset or both. As soon as a power on reset or low voltage reset is triggered the CRG
performs a quality check on the incoming clock signal. As soon as clock quality check indicates a valid
oscillator clock signal, the reset sequence starts using the oscillator clock. If after 50 check windows the
clock quality check indicated a non-valid oscillator clock, the reset sequence starts using self-clock mode.
Figure 2-26
and when the RESET pin is held low.
Freescale Semiconductor
Clock monitor is enabled (CME = 1)
Loss of clock is detected
Self-clock mode is disabled (SCME = 0).
Clock Monitor Reset
Computer Operating Properly Watchdog (COP) Reset
Power On Reset, Low Voltage Reset
and
Figure 2-27
Definition”). In detail the CME and the SCME are reset to logical ‘1’ (which
show the power-up sequence for cases when the RESET pin is tied to V
MC9S12XDP512 Data Sheet, Rev. 2.21
DD
to the MCU has reached a certain level and asserts power
Chapter 2 Clocks and Reset Generator (S12CRGV6)
Section 2.3,
DD
115

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