MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 1232

• Manufacturer Part Number: MC9S12XDT256CAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256CAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 30 Security (S12X9SECV2)
30.1.4.1
30.1.4.2
Special single chip mode means BDM is active after reset. The availability of BDM firmware commands
depends on the security state of the device. The BDM secure firmware first performs a blank check of both
the Flash memory and the EEPROM. If the blank check succeeds, security will be temporarily turned off
and the state of the security bits in the appropriate Flash memory location can be changed If the blank
check fails, security will remain active, only the BDM hardware commands will be enabled, and the
accessible memory space is restricted to the peripheral register area. This will allow the BDM to be used
to erase the EEPROM and Flash memory without giving access to their contents. After erasing both Flash
memory and EEPROM, another reset into special single chip mode will cause the blank check to succeed
and the options/security byte can be programmed to “unsecured” state via BDM.
While the BDM is executing the blank check, the BDM interface is completely blocked, which means that
all BDM commands are temporarily blocked.
30.1.4.3
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Background debug module (BDM) operation is completely disabled.
Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide
(FTX) for details.
Tracing code execution using the DBG module is disabled.
Debugging XGATE code (breakpoints, single-stepping) is disabled.
BDM firmware commands are disabled.
BDM hardware commands are restricted to the register space.
Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide
(FTX) for details.
Tracing code execution using the DBG module is disabled.
Debugging XGATE code (breakpoints, single-stepping) is disabled.
BDM operation is completely disabled.
Internal Flash memory and EEPROM are disabled.
Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide
(FTX) for details.
Tracing code execution using the DBG module is disabled.
Debugging XGATE code (breakpoints, single-stepping) is disabled.
Normal Single Chip Mode (NS)
Special Single Chip Mode (SS)
Expanded Modes (NX, ES, EX, and ST)
MC9S12XDP512 Data Sheet, Rev. 2.21
Freescale Semiconductor