MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 1233

IC MCU 256K FLASH 80-QFP

MC9S12XDT256CAA

Manufacturer Part Number
MC9S12XDT256CAA
Description
IC MCU 256K FLASH 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XDT256CAA

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
59
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
S12XD
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
59
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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30.1.5
Unsecuring the microcontroller can be done by three different methods:
30.1.5.1
In normal modes (single chip and expanded), security can be temporarily disabled using the backdoor key
access method. This method requires that:
The backdoor key values themselves would not normally be stored within the application data, which
means the application program would have to be designed to receive the backdoor key values from an
external source (e.g. through a serial port). It is not possible to download the backdoor keys using
background debug mode.
The backdoor key access method allows debugging of a secured microcontroller without having to erase
the Flash. This is particularly useful for failure analysis.
30.1.5.2
These are the necessary steps for a successful backdoor key access sequence:
Freescale Semiconductor
1. Backdoor key access
2. Reprogramming the security bits
3. Complete memory erase (special modes)
1. Set the KEYACC bit in the Flash configuration register FCNFG.
2. Write the first 16-bit word of the backdoor key to 0xFF00 (0x7F_FF00).
3. Write the second 16-bit word of the backdoor key to 0xFF02 (0x7F_FF02).
4. Write the third 16-bit word of the backdoor key to 0xFF04 (0x7F_FF04).
5. Write the fourth 16-bit word of the backdoor key to 0xFF06 (0x7F_FF06).
6. Clear the KEYACC bit in the Flash Configuration register FCNFG.
The backdoor key at 0xFF00–0xFF07 (= global addresses 0x7F_FF00–0x7F_FF07) has been
programmed to a valid value.
The KEYEN[1:0] bits within the Flash options/security byte select ‘enabled’.
In single chip mode, the application program programmed into the microcontroller must be
designed to have the capability to write to the backdoor key locations.
Unsecuring the Microcontroller
Unsecuring the MCU Using the Backdoor Key Access
Backdoor Key Access Sequence
No word of the backdoor key is allowed to have the value 0x0000 or
0xFFFF.
Flash cannot be read while KEYACC is set. Therefore the code for the
backdoor key access sequence must execute from RAM.
MC9S12XDP512 Data Sheet, Rev. 2.21
NOTE
NOTE
Chapter 30 Security (S12X9SECV2)
1235

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