MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 1242

IC MCU 256K FLASH 80-QFP

MC9S12XDT256CAA

Manufacturer Part Number
MC9S12XDT256CAA
Description
IC MCU 256K FLASH 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XDT256CAA

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
59
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
S12XD
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
59
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12XDT256CAA
Manufacturer:
FREESCALE
Quantity:
6 540
Part Number:
MC9S12XDT256CAA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XDT256CAA
Manufacturer:
FREESCALE
Quantity:
6 540
Part Number:
MC9S12XDT256CAAR
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Appendix A Electrical Characteristics
A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
T
T
P
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
1244
J
A
D
INT
JA
=
=
1. Internal voltage regulator disabled
2. Internal voltage regulator enabled
=
=
Junction Temperature, [ C
Ambient Temperature, [ C
=
Total Chip Power Dissipation, [W]
Package Thermal Resistance, [ C/W]
P
For R
respectively
I
additionally contains the current flowing into the external loads with output high.
P
Chip Internal Power Dissipation, [W]
DDR
IO
IO
is the sum of all output currents on I/O ports associated with V
is the sum of all output currents on I/O ports associated with V
Power Dissipation and Thermal Characteristics
is the current shown in Table A-10. and not the overall current flowing into V
DSON
is valid:
P
INT
R
DSON
=
I
P
R
DD
INT
MC9S12XDP512 Data Sheet, Rev. 2.21
DSON
=
V
P
P
=
DD
V
----------------------------------- - for outputs driven high
IO
IO
T
I
DD5
J
DDR
=
P
+
=
=
=
D
I
V
----------- - for outputs driven low
I
I
OH
DDPLL
OL
OL
T
=
i
i
A
V
V
P
;
OH
+
R
R
DDR
INT
DSON
DSON
P
;
D
V
+
+
DDPLL
P
I
DDA
IO
JA
I
I
IO i
IO i
2
2
+
V
DDA
I
DDA
V
DDX
DDX
DDA
and V
and V
Freescale Semiconductor
DDR
DDR
.
.
J
DDR
) in C can be
, which

Related parts for MC9S12XDT256CAA