MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 39

• Manufacturer Part Number: MC9S12XDT256CAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256CAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Freescale Semiconductor
CPU and BDM
Local Memory Map
0x0000
0x0800
0x0C00
0x1000
0x2000
0x4000
0x8000
0xC000
0xFFFF
1K EEPROM window
16K FLASH window
2K REGISTERS
4K RAM window
Reset Vectors
1K EEPROM
16K FLASH
16K FLASH
Unpaged
Unpaged
8K RAM
Figure 1-3. S12X CPU & BDM Global Address Mapping
MC9S12XDP512 Data Sheet, Rev. 2.21
RPAGE
EPAGE
PPAGE
EEPROM_LOW
FLASH_LOW
0x3F_FFFF
0x00_0000
0x00_07FF
0x0F_FFFF
0x13_FFFF
0x1F_FFFF
0x7F_FFFF
RAM_LOW
Global Memory Map
Chapter 1 Device Overview MC9S12XD-Family
2K REGISTERS
Unimplemented
Unimplemented
Unimplemented
EEPROM
EEPROM
External
FLASH
FLASH
Space
RAM
RAM
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