MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 572

IC MCU 256K FLASH 80-QFP

MC9S12XDT256CAA

Manufacturer Part Number
MC9S12XDT256CAA
Description
IC MCU 256K FLASH 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XDT256CAA

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
59
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
S12XD
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
59
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 15 Background Debug Module (S12XBDMV2)
15.2
A single-wire interface pin called the background debug interface (BKGD) pin is used to communicate
with the BDM system. During reset, this pin is a mode select input which selects between normal and
special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the
background debug mode.
15.3
15.3.1
Table 15-1
572
External Signal Description
Memory Map and Register Definition
shows the BDM memory map when BDM is active.
Module Memory Map
0x7FFF0C–0x7FFF0E
0x7FFF00–0x7FFF0B
0x7FFF10–0x7FFFFF
Global Address
0x7FFF0F
MC9S12XDP512 Data Sheet, Rev. 2.21
Table 15-1. BDM Memory Map
Family ID (part of BDM firmware ROM)
BDM firmware ROM
BDM firmware ROM
BDM registers
Module
Freescale Semiconductor
(Bytes)
Size
240
12
3
1

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