MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 786

IC MCU 256K FLASH 80-QFP

MC9S12XDT256CAA

Manufacturer Part Number
MC9S12XDT256CAA
Description
IC MCU 256K FLASH 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XDT256CAA

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
59
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
S12XD
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
59
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 21 External Bus Interface (S12XEBIV2)
21.1.3
Figure 21-1
21.2
The user is advised to refer to the SoC section for port configuration and location of external bus signals.
Table 21-1
and PIM section for reset states of these pins and associated pull-ups or pull-downs.
788
External Signal Description
outlines the pin names and gives a brief description of their function. Refer to the SoC section
Block Diagram
is a block diagram of the XEBI with all related I/O signals.
The following external bus related signals are described in other sections:
CS2, CS1, CS0 (chip selects) — S12X_MMC section
ECLK, ECLKX2 (free-running clocks) — PIM section
TAGHI, TAGLO (tag inputs) — PIM section, S12X_DBG section
EWAIT
MC9S12XDP512 Data Sheet, Rev. 2.21
Figure 21-1. XEBI Block Diagram
XEBI
NOTE
ADDR[22:0]
DATA[15:0]
IVD[15:0]
LSTRB
R/W
UDS
LDS
RE
WE
ACC[2:0]
IQSTAT[3:0]
Freescale Semiconductor

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