MC56F8345VFGE Freescale Semiconductor, MC56F8345VFGE Datasheet - Page 169

IC DSP 16BIT 60MHZ 128-LQFP

MC56F8345VFGE

Manufacturer Part Number
MC56F8345VFGE
Description
IC DSP 16BIT 60MHZ 128-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet

Specifications of MC56F8345VFGE

Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
49
Program Memory Size
136KB (68K x 16)
Program Memory Type
FLASH
Ram Size
6K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
128-LQFP
Data Bus Width
16 bit
Processor Series
MC56F83xx
Core
56800E
Numeric And Arithmetic Format
Fixed-Point
Device Million Instructions Per Second
60 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
49
Data Ram Size
8 KB
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Interface Type
SCI, SPI, CAN
Minimum Operating Temperature
- 40 C
For Use With
MC56F8367EVME - EVAL BOARD FOR MC56F83X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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12.3 Power Distribution and I/O Ring Implementation
Figure 12-1
contains two internal power regulators. One of them is powered from the V
be turned off. This regulator controls power to the internal clock generation circuitry. The other regulator
is powered from the V
peripherals and the internal memories. This regulator can be turned off, if an external V
is externally applied to the V
In summary, the entire chip can be supplied from a single 3.3 volt supply if the large core regulator is
enabled. If the regulator is not enabled, a dual supply 3.3V/2.5V configuration can also be used.
Notes:
Freescale Semiconductor
Preliminary
Because the device’s output signals have fast rise and fall times, PCB trace lengths should be minimal
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.
This is especially critical in systems with higher capacitive loads that could create higher transient currents
in the V
Take special care to minimize noise levels on the V
Designs that utilize the TRST pin for JTAG port or OnCE module functionality (such as development or
debugging systems) should allow a means to assert TRST whenever RESET is asserted, as well as a means
to assert TRST independently of RESET. Designs that do not require debugging functionality, such as
consumer products, should tie these pins together.
Because the Flash memory is programmed through the JTAG/OnCE port, the designer should provide an
interface to this port to allow in-circuit Flash programming
Flash, RAM and internal logic are powered from the core regulator output
V
All circuitry, analog and digital, shares a common V
PP
1 and V
V
DDA_OSC_PLL
illustrates the general power control incorporated in the 56F8345/56F8145. This chip
DD
REG
and V
PP
2 are not connected in the customer system
DD_IO
SS
circuits.
OSC
CAP
pins and provides power to all of the internal digital logic of the core, all
pins.
Figure 12-1 Power Management
REG
56F8345 Technical Data, Rev. 17
V
DD
CORE
V
SS
V
REF
SS
CAP
, V
bus
DDA
I/O
and V
Power Distribution and I/O Ring Implementation
SSA
pins
DDA_OSC_PLL
V
V
SSA_ADC
ADC
DDA_ADC
DD_CORE
V
V
V
V
V
pin and cannot
REFH
REFP
REFMID
REFN
REFLO
voltage
169

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