MC9S12XEP100CAL Freescale Semiconductor, MC9S12XEP100CAL Datasheet - Page 1044

IC MCU 16BIT 1M FLASH 112-LQFP

MC9S12XEP100CAL

Manufacturer Part Number
MC9S12XEP100CAL
Description
IC MCU 16BIT 1M FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XEP100CAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
64 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 12-bit
Package
112LQFP
Family Name
HCS12X
Maximum Speed
50 MHz
Operating Supply Voltage
1.8|2.8|5 V
For Use With
EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12XEP100CAL
Manufacturer:
TOSHIBA
Quantity:
72
Part Number:
MC9S12XEP100CAL
Manufacturer:
FREESCALE
Quantity:
2 689
Part Number:
MC9S12XEP100CAL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XEP100CAL
Manufacturer:
FREESCALE
Quantity:
2 689
Chapter 27 512 KByte Flash Module (S12XFTM512K3V1)
27.3.2.12 EEE Tag Counter Register (ETAG)
The ETAG register contains the number of outstanding words in the buffer RAM EEE partition that need
to be programmed into the D-Flash EEE partition. The ETAG register is decremented prior to the related
tagged word being programmed into the D-Flash EEE partition. All tagged words have been programmed
into the D-Flash EEE partition once all bits in the ETAG register read 0 and the MGBUSY flag in the
FSTAT register reads 0.
All ETAG bits are readable but not writable and are cleared by the Memory Controller.
27.3.2.13 Flash ECC Error Results Register (FECCR)
The FECCR registers contain the result of a detected ECC fault for both single bit and double bit faults.
The FECCR register provides access to several ECC related fields as defined by the ECCRIX index bits
in the FECCRIX register (see
1044
Offset Module Base + 0x000C
Offset Module Base + 0x000D
Reset
Reset
W
W
R
R
0
0
7
7
CCOBIX[2:0]
= Unimplemented or Reserved
= Unimplemented or Reserved
011
100
101
Table 27-26. FCCOB - NVM Command Mode (Typical Usage)
Figure 27-19. EEE Tag Counter Low Register (ETAGLO)
Figure 27-18. EEE Tag Counter High Register (ETAGHI)
0
0
6
6
Section
MC9S12XE-Family Reference Manual , Rev. 1.23
Byte
LO
LO
LO
HI
HI
HI
0
0
5
5
27.3.2.4). Once ECC fault information has been stored, no other
FCCOB Parameter Fields (NVM Command Mode)
0
0
4
4
ETAG[15:8]
ETAG[7:0]
Data 1 [15:8]
Data 2 [15:8]
Data 3 [15:8]
Data 1 [7:0]
Data 2 [7:0]
Data 3 [7:0]
0
0
3
3
0
0
2
2
Freescale Semiconductor
0
0
1
1
0
0
0
0

Related parts for MC9S12XEP100CAL