MC9S12XEP100CAL Freescale Semiconductor, MC9S12XEP100CAL Datasheet - Page 1209

• Manufacturer Part Number: MC9S12XEP100CAL
• Description: IC MCU 16BIT 1M FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEP100CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 64 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 12-bit
• Package: 112LQFP
• Family Name: HCS12X
• Maximum Speed: 50 MHz
• Operating Supply Voltage: 1.8|2.8|5 V
• For Use With: EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
T
T
P
Θ
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
Freescale Semiconductor
J
A
D
INT
JA
P
R
=
D
=
1. Internal voltage regulator disabled
2. Internal voltage regulator enabled
R
=
DSON
P
=
DSON
Junction Temperature, [°C ]
=
Ambient Temperature, [°C ]
=
Total Chip Power Dissipation, [W]
IO
Package Thermal Resistance, [°C/W]
P
P
Chip Internal Power Dissipation, [W]
IO
=
INT
=
is the sum of all output currents on I/O ports associated with V
∑
Power Dissipation and Thermal Characteristics
=
i
+
V
--------------------------------------- for outputs driven high
V
----------- - for outputs driven low
DD35
P
I
R
OL
OL
IO
DSON
I
OH
;
–
V
⋅
OH
I
P
IO i
INT
;
2
=
MC9S12XE-Family Reference Manual Rev. 1.23
P
I
INT
DD
⋅
=
V
DD
I
DDR
T
J
+
=
I
⋅
DDPLL
T
V
A
DDR
+
(
P
⋅
+
D
V
I
•
DDA
DDPLL
Θ
JA
⋅
)
V
DDA
+
I
DDA
⋅
V
DDX
DDA
Appendix A Electrical Characteristics
, whereby
J
) in °C can be
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