MC9S12XEP100CAL Freescale Semiconductor, MC9S12XEP100CAL Datasheet - Page 1222

IC MCU 16BIT 1M FLASH 112-LQFP

MC9S12XEP100CAL

Manufacturer Part Number
MC9S12XEP100CAL
Description
IC MCU 16BIT 1M FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XEP100CAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
64 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 12-bit
Package
112LQFP
Family Name
HCS12X
Maximum Speed
50 MHz
Operating Supply Voltage
1.8|2.8|5 V
For Use With
EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Appendix A Electrical Characteristics
A.2.2.1
PortAD output drivers switching can adversely affect the ATD accuracy whilst converting the analog
voltage on other PortAD pins because the output drivers are supplied from the VDDA/VSSA ATD supply
pins. Although internal design measures are implemented to minimize the affect of output driver noise, it
is recommended to configure PortAD pins as outputs only for low frequency, low load outputs. The impact
on ATD accuracy is load dependent and not specified. The values specified are valid under condition that
no PortAD output drivers switch during conversion.
A.2.2.2
Due to the input pin leakage current as specified in
there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
specifies results in an error (10-bit resolution) of less than 1/2 LSB (2.5 mV) at the maximum leakage
current. If device or operating conditions are less than worst case or leakage-induced error is acceptable,
larger values of source resistance of up to 10Kohm are allowed.
A.2.2.3
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB (10-bit resolution), then the external filter capacitor, C
A.2.2.4
There are two cases to consider.
1222
1. A current is injected into the channel being converted. The channel being stressed has conversion
2. Current is injected into pins in the neighborhood of the channel being converted. A portion of this
values of $3FF (in 10-bit mode) for analog inputs greater than V
V
current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy
of the conversion depending on the source resistance.
RL
unless the current is higher than specified as disruptive condition.
Port AD Output Drivers Switching
Source Resistance
Source Capacitance
Current Injection
MC9S12XE-Family Reference Manual , Rev. 1.23
Table A-8
in conjunction with the source resistance
f
≥ 1024 * (C
RH
and $000 for values less than
INS
Freescale Semiconductor
–C
INN
).
S

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