MC9S12XEP100CAL Freescale Semiconductor, MC9S12XEP100CAL Datasheet - Page 1262

IC MCU 16BIT 1M FLASH 112-LQFP

MC9S12XEP100CAL

Manufacturer Part Number
MC9S12XEP100CAL
Description
IC MCU 16BIT 1M FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XEP100CAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
64 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 12-bit
Package
112LQFP
Family Name
HCS12X
Maximum Speed
50 MHz
Operating Supply Voltage
1.8|2.8|5 V
For Use With
EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Appendix B Package Information
B.3
1262
PIN 1
IDENT
C
L
C1
112-Pin LQFP Package
28
1
4X
C2
112
29
VIEW Y
0.050
VIEW AB
0.20
S1
A1
Figure B-3. 112-Pin LQFP Mechanical Dimensions (Case No. 987)
T
L-M
N
θ
A
S
MC9S12XE-Family Reference Manual , Rev. 1.23
N
(Y)
(Z)
(K)
E
R
θ
θ
4X 28 TIPS
2
3
R2
R
R1
85
56
θ
1
84
57
M
0.20
B1
GAGE PLANE
0.25
VIEW AB
T
T
V1
L-M
0.10
B
SEATING
PLANE
N
T
V
112X
C L
ROTATED 90 COUNTERCLOCKWISE
J1
J1
NOTES:
J
1. DIMENSIONING AND TOLERANCING PER
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M AND N TO BE DETERMINED AT
4. DIMENSIONS S AND V TO BE DETERMINED AT
5. DIMENSIONS A AND B DO NOT INCLUDE
6. DIMENSION D DOES NOT INCLUDE DAMBAR
ASME Y14.5M, 1994.
SEATING PLANE, DATUM T.
SEATING PLANE, DATUM T.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B INCLUDE MOLD MISMATCH.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.46.
SECTION J1-J1
0.13
DIM
A1
B1
C1
C2
R1
R2
AA
θ
θ
θ
S1
V1
A
B
C
D
E
F
G
J
K
P
S
V
Y
Z
θ
1
2
3
108X
°
VIEW Y
0.050
1.350
0.270
0.450
0.270
0.090
0.100
0.100
0.090
MILLIMETERS
M
MIN
11
11
20.000 BSC
10.000 BSC
20.000 BSC
10.000 BSC
22.000 BSC
11.000 BSC
22.000 BSC
11.000 BSC
0.650 BSC
0.500 REF
0.325 BSC
0.250 REF
1.000 REF
---
0
0
D
F
°
°
°
°
G
T
1.600
0.150
1.450
0.370
0.750
0.330
0.170
0.200
0.200
0.160
4X
MAX
13
Freescale Semiconductor
L-M
13
8
7
°
°
°
°
P
X=L, M OR N
X
N
AA
BASE
METAL

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