MC9S12XEP100CAL Freescale Semiconductor, MC9S12XEP100CAL Datasheet - Page 281

IC MCU 16BIT 1M FLASH 112-LQFP

MC9S12XEP100CAL

Manufacturer Part Number
MC9S12XEP100CAL
Description
IC MCU 16BIT 1M FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XEP100CAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
64 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 12-bit
Package
112LQFP
Family Name
HCS12X
Maximum Speed
50 MHz
Operating Supply Voltage
1.8|2.8|5 V
For Use With
EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 7
Background Debug Module (S12XBDMV2)
7.1
This section describes the functionality of the background debug module (BDM) sub-block of the
HCS12X core platform.
The background debug module (BDM) sub-block is a single-wire, background debug system implemented
in on-chip hardware for minimal CPU intervention. All interfacing with the BDM is done via the BKGD
pin.
The BDM has enhanced capability for maintaining synchronization between the target and host while
allowing more flexibility in clock rates. This includes a sync signal to determine the communication rate
and a handshake signal to indicate when an operation is complete. The system is backwards compatible to
the BDM of the S12 family with the following exceptions:
7.1.1
The BDM includes these distinctive features:
Freescale Semiconductor
Revision
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
Number
V02.00
V02.01
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
TAGGO command no longer supported by BDM
External instruction tagging feature now part of DBG module
BDM register map and register content extended/modified
Global page access functionality
Enabled but not active out of reset in emulation modes (if modes available)
CLKSW bit set out of reset in emulation modes (if modes available).
Family ID readable from firmware ROM at global address 0x7FFF0F (value for HCS12X devices
is 0xC1)
Single-wire communication with host development system
Enhanced capability for allowing more flexibility in clock rates
SYNC command to determine communication rate
GO_UNTIL command
Hardware handshake protocol to increase the performance of the serial communication
Introduction
Revision Date
Features
14 May 2008
07 Mar 2006
Sections
Affected
MC9S12XE-Family Reference Manual , Rev. 1.23
Table 7-1. Revision History
- First version of S12XBDMV2
- Introduced standardized Revision History Table
Description of Changes
281

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