MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 131

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

MPC555
USER’S MANUAL
/
MPC556
SPR Number
(Decimal)
272
273
274
275
284
285
287
528
536
560
18
19
22
26
27
80
81
82
Freescale Semiconductor, Inc.
For More Information On This Product,
Table 3-2 Supervisor-Level SPRs
DAE/Source Instruction Service Register (DSISR)
See
(DSISR)
Data Address Register (DAR)
See
tions.
Decrementer Register (DEC)
See
tions.
Save and Restore Register 0 (SRR0)
See
(SRR0)
Save and Restore Register 1 (SRR1)
See
(SRR1)
External Interrupt Enable (EIE)
See
isters
External Interrupt Disable (EID)
See
isters
Non-Recoverable Interrupt (NRI)
See
isters
SPR General 0 (SPRG0)
See
scriptions.
SPRGeneral 1 (SPRG1)
See
scriptions.
SPR General 2 (SPRG2)
See
scriptions.
SPR General 3 (SPRG3)
See
scriptions.
Time Base Lower – Write (TBL)
See
Time Base Upper – Write (TBU)
See
Processor Version Register (PVR)
See
IMPU Global Region Attribute (MI_GRA)
See
L2U Global Region Attribute (L2U_GRA)1
See
BBC Module Configuration Register (BBCMCR)1
See
CENTRAL PROCESSING UNIT
Go to: www.freescale.com
3.9.2 DAE/Source Instruction Service Register
3.9.3 Data Address Register (DAR)
3.9.5 Decrementer Register (DEC)
3.9.6 Machine Status Save/Restore Register 0
3.9.7 Machine Status Save/Restore Register 1
3.9.10.1 EIE, EID, and NRI Special-Purpose Reg-
3.9.10.1 EIE, EID, and NRI Special-Purpose Reg-
3.9.10.1 EIE, EID, and NRI Special-Purpose Reg-
3.9.8 General SPRs (SPRG0–SPRG3)
3.9.8 General SPRs (SPRG0–SPRG3)
3.9.8 General SPRs (SPRG0–SPRG3)
3.9.8 General SPRs (SPRG0–SPRG3)
Table 3-14
Table 3-14
Table 3-16
Table 4-7
Table 11-10
Table 4-8
Rev. 15 October 2000
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
Special-Purpose Register
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
1
1
1
1
for bit descrip-
for bit descrip-
for bit de-
for bit de-
for bit de-
for bit de-
MOTOROLA
3-9