MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 177

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

4.1 Burst Buffer Block Diagram
MPC555 / MPC556
USER’S MANUAL
The burst buffer module consists of the burst buffer controller (BBC) and the instruc-
tion memory protection unit (IMPU).
The BBC delivers the RCPU instruction fetch accesses from the instruction bus onto
the U-bus. It utilizes the full U-bus pipeline and a special page access attribute in order
to take full advantage of the U-bus bandwidth. It can handle both burstable and non-
burstable external memories as well as non-burstable internal memories (flash EE-
PROM, SRAM).
Code compression features are only available on the MPC556. The MPC556 utilizes
a version of code compression / decompression which is called “Phase A”. Phase A
code compression / decompression is described in this manual. Future parts may have
a different type of code compression. The BBC also contains the functional module
which is called the instruction code decompressor unit (ICDU). The ICDU is responsi-
ble for on-line (previously compressed) instruction code decompression in the “De-
compression-ON” mode. In the “Decompression-OFF” mode, the ICDU is bypassed
and the BBC is in normal function.
The IMPU allows the memory to be divided into four regions with different attributes,
as well as a default global region (for memory space that is not included in either of the
two regions). Each of the two regions can be of size four Kbytes to four Gbytes. Over-
lap between regions is allowed.
The IMPU includes registers that contain the following information: region base ad-
dress, region size and the region’s access permissions. For each access (from the
processor to the memory), the IMPU finds which region matches the address. If more
than one region matches, the region with the lowest index is chosen. If no region is
matched, the global region is chosen.
The IMPU compares the attributes of the access from the processor to the attributes
of the appropriate region. If the access is allowed, the proper signals are sent to the
BBC. If the access is not permitted, an interrupt is sent to the processor.
The IMPU does not support address translation. The effective fetch address issued by
the processor is the one that is transferred to the U-bus.
Figure 4-1
is a block diagram of the burst buffer.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
BURST BUFFER
Rev. 15 October 2000
BURST BUFFER
SECTION 4
MOTOROLA
4-1