MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 537

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

15.1 MIOS1 Features
MPC555 / MPC556
USER’S MANUAL
The modular I/O system (MIOS) consists of a library of flexible I/O and timer functions
including I/O port, counters, input capture, output compare, pulse and period measure-
ment, and PWM. Because the MIOS is composed of submodules, it is easily config-
urable for different kinds of applications. MIOS1 is the implementation of the MIOS
architecture used in the MPC555 / MPC556.
The MIOS1 is composed of the following submodules:
The basic features of the MIOS1 are as follows:
• One MIOS bus interface submodule (MBISM)
• One MIOS counter prescaler submodule (MCPSM)
• Two MIOS modulus counter submodules (MMCSM)
• 10 MIOS double action submodules (MDASM)
• Eight MIOS pulse width modulation submodules (MPWMSM)
• One MIOS 16-bit parallel port I/O submodule (MPIOSM)
• Two MIOS interrupt request submodules (MIRSM)
• Modular architecture at the silicon implementation level
• Disable capability in each submodule to allow power saving when its function is
• Two 16-bit buses to allow action submodules to use counter data
• When not used for timing functions, every channel pin can be used as a port pin:
• Submodules pin status bits:
• MIOS counter prescaler submodule (MCPSM):
• Two MIOS modulus counter submodules (MMCSM), each with these features:
not needed
I/O, output only or input only, depending on the channel function
— Centralized counter clock generator
— Programmable 4-bit modulus down-counter
— Wide range of possible division ratios: 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14,
— Count inhibit under software control
— Programmable 16-bit modulus up-counter with built-in programmable 8-bit
— Maximum increment frequency of the counter:
— Flag setting and possible interrupt generation on overflow of the up-counter
— Time counter on internal clock with interrupt capability after a pre-determined
15 and 16
prescaler clocked by MCPSM output
• clocked by the internal Counter Clock: F
• clocked by the external pin: F
time
MODULAR INPUT/OUTPUT SUBSYSTEM (MIOS1)
MODULAR INPUT/OUTPUT SUBSYSTEM (MIOS1)
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
Rev. 15 October 2000
SECTION 15
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MOTOROLA
15-1