MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 881

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

G.4.3 Testing Characteristics
G.5 Thermal Characteristics
MPC555 / MPC556
USER’S MANUAL
BGA Package Thermal Resistance,
Junction to Ambient — Natural Convection
BGA Package Thermal Resistance,
Junction to Ambient — Four layer (2s2p) board, natural
convection
BGA Package Thermal Resistance,
Junction to Board
BGA Package Thermal Resistance,
Junction to Case (top)
BGA Package Thermal Resistance,
Junction to Package Top, Natural Convection
NOTES:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
2. Per SEMI G38-87 and JESD51-2 with the board horizontal.
3. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
4. Per JESD51-6 with the board horizontal.
5. Thermal resistance between the die and the printed circuit board (Four layer [2s2p] board, natural con-
6. Indicates the thermal resistance between the die and the case top surface as measured by the cold plate
7. Thermal characterization parameter indicating the temperature difference between package top and the
1. Scan range: 150 kHz — 1000 MHz
2. Operating frequency: 20 MHz, 40 MHz
3. Operating voltages: 3.3 V, 5.0 V
4. Max spikes: 50 dBuV
5. I/O port waveforms: 50% duty cycle @ 100 µs period
6. Temperature: 25°C (-40°C, 125°C if available)
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and the board thermal resistance.
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and the board thermal resistance.
vection).
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
junction temperature per EIA/JESD51-2.
Characteristic
Freescale Semiconductor, Inc.
For More Information On This Product,
Table G-2 Thermal Characteristics
ELECTRICAL CHARACTERISTICS
Go to: www.freescale.com
Rev. 15 October 2000
Symbol
R
R
R
R
θ
θMA
θJA
θJB
θJC
JT
42.8
30.4
Value
19.9
6.3
2.7
1,2
3,4
6
7
5
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
MOTOROLA
G-3