D13002F16V Renesas Electronics America, D13002F16V Datasheet - Page 171
D13002F16V
Manufacturer Part Number
D13002F16V
Description
IC H8/3002 ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.D13002F16V.pdf
(702 pages)
Specifications of D13002F16V
Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D13002F16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Self-Refresh Mode: Some DRAM devices have a self-refresh function. After the SRFMD bit is
set to 1 in RFSHCR, when a transition to software standby mode occurs, the CAS and RAS
outputs go low in that order so that the DRAM self-refresh function can be used. On exit from
software standby mode, the CAS and RAS outputs both go high.
Table 7-7 shows the pin states in software standby mode. Figure 7-6 shows the signal output
timing.
Table 7-7 Pin States in Software Standby Mode (1) (PSRAME = 0, DRAME = 1)
Signal
HWR
LWR
RD
CS
RFSH
3
CAS/WE = 0
High-impedance
High-impedance
High-impedance
High
High
SRFMD = 0
CAS/WE = 1
High-impedance
High-impedance
High-impedance
High
High
Software Standby Mode
154
CAS/WE = 0
High
High
Low
Low
Low
SRFMD = 1 (self-refresh mode)
CAS/WE = 1
Low
Low
High
Low
Low
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