DF2398F20V Renesas Electronics America, DF2398F20V Datasheet - Page 603

IC H8S/2300 MCU FLASH 128QFP

DF2398F20V

Manufacturer Part Number
DF2398F20V
Description
IC H8S/2300 MCU FLASH 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2398F20V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
YR0K42378FC000BA - KIT EVAL FOR H8S/2378
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2398F20V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
DF2398F20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
19.5.4
Reliability of Programmed Data
An effective way to assure the data retention characteristics of the programmed chips is to bake them at 150 C, then
screen them for data errors. This procedure quickly eliminates chips with PROM memory cells prone to early failure.
Figure 19-6 shows the recommended screening procedure.
Program chip and verify data
Bake chip for 24 to 48 hours at
125 C to 150 C with power off
Read and check program
Mount
Figure 19-6 Recommended Screening Procedure
If a series of programming errors occurs while the same PROM programmer is being used, stop programming and check
the PROM programmer and socket adapter for defects.
Please inform Renesas Technology of any abnormal conditions noted during or after programming or in screening of
program data after high-temperature baking.
Rev.6.00 Oct.28.2004 page 573 of 1016
REJ09B0138-0600H

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