PIC16F688-E/ST Microchip Technology, PIC16F688-E/ST Datasheet - Page 162
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PIC16F688-E/ST
Manufacturer Part Number
PIC16F688-E/ST
Description
IC MCU FLASH 4KX14 14TSSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(204 pages)
3.PIC16F688T-ISL.pdf
(6 pages)
4.PIC16F688T-ISL.pdf
(4 pages)
5.PIC16F688T-ISL.pdf
(688 pages)
6.PIC16F688-EP.pdf
(174 pages)
Specifications of PIC16F688-E/ST
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
14-TSSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SCI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Data Rom Size
256 B
Height
0.9 mm
Length
5 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
4.4 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT14SS-1 - SOCKET TRANSITION 14DIP/14SSOPAC162061 - HEADER INTRFC MPLAB ICD2 20PINAC162056 - HEADER INTERFACE ICD2 16F688
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC16F688
16.2
The following sections give the technical details of the
packages.
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS41203B-page 160
Package Details
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
E1
eB
E
Dimension Limits
2
1
§
c
D
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
A
A1
MIN
Preliminary
.140
.115
.015
.300
.240
.740
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.750
.130
.012
.058
.018
.370
14
10
10
B
B1
MAX
.170
.145
.325
.260
.760
.135
.015
.070
.022
.430
15
15
MIN
18.80
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
p
5
5
MILLIMETERS
2004 Microchip Technology Inc.
NOM
19.05
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
A2
14
10
10
L
MAX
19.30
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15