PIC18F8410-E/PT Microchip Technology, PIC18F8410-E/PT Datasheet - Page 6
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PIC18F8410-E/PT
Manufacturer Part Number
PIC18F8410-E/PT
Description
IC PIC MCU FLASH 16KX16 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F6310-IPT.pdf
(412 pages)
2.PIC18F6310-IPT.pdf
(16 pages)
3.PIC18F6310-IPT.pdf
(4 pages)
4.PIC18F6310-IPT.pdf
(28 pages)
5.PIC18F6310-IPT.pdf
(6 pages)
6.PIC18F6310-IPT.pdf
(4 pages)
Specifications of PIC18F8410-E/PT
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TFQFP
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F8410-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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PIC18F6310/6410/8310/8410
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Interrupts .................................................................................................................................................................................. 109
11.0 I/O Ports ................................................................................................................................................................................... 125
12.0 Timer0 Module ......................................................................................................................................................................... 151
13.0 Timer1 Module ......................................................................................................................................................................... 155
14.0 Timer2 Module ......................................................................................................................................................................... 161
15.0 Timer3 Module ......................................................................................................................................................................... 163
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 167
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 177
18.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 217
19.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) ........................................................... 241
20.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 255
21.0 Comparator Module.................................................................................................................................................................. 265
22.0 Comparator Voltage Reference Module ................................................................................................................................... 271
23.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 275
24.0 Special Features of the CPU .................................................................................................................................................... 281
25.0 Instruction Set Summary .......................................................................................................................................................... 297
26.0 Development Support............................................................................................................................................................... 347
27.0 Electrical Characteristics .......................................................................................................................................................... 351
28.0 Packaging Information.............................................................................................................................................................. 389
Appendix A: Revision History............................................................................................................................................................. 395
Appendix B: Device Differences......................................................................................................................................................... 395
Appendix C: Conversion Considerations ........................................................................................................................................... 396
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 396
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 397
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 397
Index .................................................................................................................................................................................................. 399
The Microchip Web Site ..................................................................................................................................................................... 409
Customer Change Notification Service .............................................................................................................................................. 409
Customer Support .............................................................................................................................................................................. 409
Reader Response .............................................................................................................................................................................. 410
PIC18F6310/6410/8310/8410 Product Identification System ............................................................................................................ 411
DS39635C-page 6
Device Overview .......................................................................................................................................................................... 9
Guidelines for Getting Started with PIC18F Microcontrollers ..................................................................................................... 31
Oscillator Configurations ............................................................................................................................................................ 35
Power-Managed Modes ............................................................................................................................................................. 45
Reset .......................................................................................................................................................................................... 55
Memory Organization ................................................................................................................................................................. 67
Program Memory........................................................................................................................................................................ 89
External Memory Interface ......................................................................................................................................................... 95
8 x 8 Hardware Multiplier.......................................................................................................................................................... 107
2010 Microchip Technology Inc.
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