PIC16F874A-E/P Microchip Technology, PIC16F874A-E/P Datasheet - Page 110
![IC MCU FLASH 4KX14 W/AD 40-DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F874A-E/P
Manufacturer Part Number
PIC16F874A-E/P
Description
IC MCU FLASH 4KX14 W/AD 40-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873A-ISO.pdf
(234 pages)
5.PIC16F873A-ISO.pdf
(6 pages)
6.PIC16F873A-ISO.pdf
(4 pages)
7.PIC16F873A-ISO.pdf
(6 pages)
8.PIC16F873A-ISO.pdf
(4 pages)
9.PIC16F873A-ISO.pdf
(22 pages)
Specifications of PIC16F874A-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
1 x 16 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Data Rom Size
128 B
Height
3.81 mm
Length
52.26 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
13.84 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F874A-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC16F87XA
9.4.17.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user deasserts SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD<6:0> and
counts down to 0. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, see
Figure 9-29). If SDA is sampled high, the BRG is
FIGURE 9-29:
FIGURE 9-30:
DS39582B-page 108
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
reloaded and begins counting. If SDA goes from high to
low before the BRG times out, no bus collision occurs
because no two masters can assert SDA at exactly the
same time.
If SCL goes from high to low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition
(Figure 9-30).
If at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
T
Cleared in software
BRG
2003 Microchip Technology Inc.
Interrupt cleared
in software
‘0’
‘0’
‘0’