PIC18F2620-E/SP Microchip Technology, PIC18F2620-E/SP Datasheet - Page 368
PIC18F2620-E/SP
Manufacturer Part Number
PIC18F2620-E/SP
Description
IC MCU FLASH 32KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18F2525-ISO.pdf
(412 pages)
4.PIC18F2525-ISO.pdf
(18 pages)
5.PIC18F2525-ISO.pdf
(18 pages)
6.PIC18F2525-ISO.pdf
(6 pages)
7.PIC18F2525-ISO.pdf
(6 pages)
8.PIC18LF4620-IP.pdf
(390 pages)
Specifications of PIC18F2620-E/SP
Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3986 B
Interface Type
SPI/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DB18F4620 - BOARD DAUGHTER ICEPIC3DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18F2525-ISO PDF datasheet #3
- PIC18F2525-ISO PDF datasheet #4
- PIC18F2525-ISO PDF datasheet #5
- PIC18F2525-ISO PDF datasheet #6
- PIC18F2525-ISO PDF datasheet #7
- PIC18LF4620-IP PDF datasheet #8
- Current page: 368 of 390
- Download datasheet (7Mb)
PIC18F2525/2620/4525/4620
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS39626B-page 366
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
D
L
MIN
Preliminary
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
28
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
2004 Microchip Technology Inc.
NOM
28
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8
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