PIC16C66-10I/SP Microchip Technology, PIC16C66-10I/SP Datasheet - Page 294
![IC MCU OTP 8KX14 PWM 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16C66-10I/SP
Manufacturer Part Number
PIC16C66-10I/SP
Description
IC MCU OTP 8KX14 PWM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16LC62A-04SP.pdf
(337 pages)
4.PIC16C66-04SO.pdf
(6 pages)
Specifications of PIC16C66-10I/SP
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
14KB (8K x 14)
Program Memory Type
OTP
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16LC62A-04SP PDF datasheet #3
- PIC16C66-04SO PDF datasheet #4
- Current page: 294 of 337
- Download datasheet (3Mb)
PIC16C6X
25.4
DS30234D-page 294
Symbol
Chamfer
h x 45
Seating
Plane
CP
A1
C
D
H
N
A
B
E
e
h
L
Index
Area
18-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body) (SO)
CP
A1
11.353
10.007
N
2.362
0.101
0.355
0.241
7.416
1.270
0.381
0.406
B
1
Min
18
0
–
A
2
3
Millimeters
11.735
10.643
2.642
0.300
0.483
0.318
7.595
1.270
0.762
1.143
0.102
Max
Package Group: Plastic SOIC (SO)
18
8
D
e
Reference
Notes
E
H
Base
Plane
0.093
0.004
0.014
0.009
0.447
0.292
0.050
0.394
0.015
0.016
Min
18
0
–
h x 45
Inches
1997 Microchip Technology Inc.
0.050
0.104
0.012
0.019
0.013
0.462
0.299
0.419
0.030
0.045
0.004
Max
18
8
L
Reference
Notes
C
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