LH7A400N0G000B5;55 NXP Semiconductors, LH7A400N0G000B5;55 Datasheet - Page 2

• Manufacturer Part Number: LH7A400N0G000B5;55
• Description: IC ARM9 BLUESTREAK MCU 256BGA
• Manufacturer: NXP Semiconductors
• Series: BlueStreak ; LH7Ar

Specifications of LH7A400N0G000B5;55

• Core Size: 16/32-Bit
• Core Processor: ARM9
• Speed: 200MHz
• Connectivity: EBI/EMI, IrDA, Microwire, MMC, SmartCard, SPI, SSI, SSP, UART/USART, USB
• Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Type: ROMless
• Ram Size: 80K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-BGA
• Controller Family/series: (ARM9)
• No. Of I/o's: 60
• Ram Memory Size: 80KB
• Cpu Speed: 200MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 2
• Digital Ic Case Style: BGA
• Processor Series: LH7A4
• Core: ARM9TDMI
• Data Bus Width: 32 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4334; 935285038557

LH7A400
2
LH7A400N0G000B5
LH7A400N0F000B3A
LH7A400N0F000B5
LH7A400N0F076B5
Type number
BGA256
LFBGA256
LFBGA256
LFBGA256
Name
Table 2. Ordering information
Rev. 01 — 16 July 2007
NXP Semiconductors
plastic ball grid array package; 256 balls
plastic low profile fine-pitch ball grid array
package; 256 balls
plastic low profile fine-pitch ball grid array
package; 256 balls
plastic low profile fine-pitch ball grid array
package; 256 balls
Package
Description
32-Bit System-on-Chip
Preliminary data sheet
SOT1018-1
SOT1020-1
SOT1020-1
SOT1020-1
Version