ST72F63BK4M1 STMicroelectronics, ST72F63BK4M1 Datasheet - Page 147
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ST72F63BK4M1
Manufacturer Part Number
ST72F63BK4M1
Description
IC MCU 8BIT LS 16K 34-SOIC
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST72F63BD6U1TR.pdf
(186 pages)
Specifications of ST72F63BK4M1
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SCI, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
19
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
34-SOIC (7.5mm Width)
Processor Series
ST72F6x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
I2C, SCI, USB
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
27
Number Of Timers
2 x 16 bit
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7MDTU3-EPB/US, ST72F63B-SK/RAIS, ST7MDTU3-EMU3, STX-RLINK
Minimum Operating Temperature
0 C
On-chip Adc
8 bit
For Use With
497-5521 - EVAL BOARD LOW SPEED USB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-2115-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST72F63BK4M1
Manufacturer:
ST
Quantity:
20 000
ST7263Bxx
13.7
13.7.1
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling 2 LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
●
●
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations:
The software flowchart must include the management of runaway conditions such as:
●
●
●
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Table 66.
Symbol
V
V
FESD
FFTB
ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
FTB: A burst of fast transient voltage (positive and negative) is applied to V
through a 100pF capacitor, until a functional disturbance occurs. This test conforms
with the IEC 1000-4-4 standard.
Corrupted program counter
Unexpected reset
Critical data corruption (control registers...)
Voltage limits to be applied on any I/O pin
to induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100 pF on V
pins to induce a functional disturbance
EMC characteristics
Parameter
Doc ID 7516 Rev 8
DD
and V
DD
V
SDIP32
conforms to IEC 1000-4-2
V
SDIP32
conforms to IEC 1000-4-4
DD
DD
=5 V, T
=5 V, T
A
A
=+25 °C, f
=+25 °C, f
Conditions
Electrical characteristics
OSC
OSC
=8 MHz,
=8 MHz,
DD
and V
147/186
Level/
Class
4B
4A
SS