TMP86FS28DFG(JZ) Toshiba, TMP86FS28DFG(JZ) Datasheet - Page 267

• Manufacturer Part Number: TMP86FS28DFG(JZ)
• Description: IC MCU 8BIT FLASH 60KB 80-LQFP
• Manufacturer: Toshiba
• Series: TLCS-870/Cr

Specifications of TMP86FS28DFG(JZ)

• Core Processor: 870/C
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: SIO, UART/USART
• Peripherals: LCD, PWM, WDT
• Number Of I /o: 62
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Processor Series: TLCS-870
• Core: 870/C
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SIO, UART
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 62
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: BM1040R0A, BMP86A100010A, BMP86A100010B, BMP86A200010B, BMP86A200020A, BMP86A300010A, BMP86A300020A, BMP86A300030A, SW89CN0-ZCC, SW00MN0-ZCC
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: BM1401W0A-G - FLASH WRITER ON-BOARD PROGRAMTMP89C900XBG - EMULATION CHIP TMP89F LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: TMP86FS28DFGJZ

20.7 Recommended Oscillating Conditions
20.8 Handling Precaution
Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these
Note 2: For the resonators to be used with Toshiba microcontrollers, we recommend ceramic resonators manufactured by
- The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown
- When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we
below.
1. When using the Sn-37Pb solder bath
2. When using the Sn-3.0Ag-0.5Cu solder bath
recommend electrically shielding the package in order to maintain normal operating condition.
factors are greatly affected by board patterns, please be sure to evaluate operation on the board on which the
device will actually be mounted.
Murata Manufacturing Co., Ltd.
For details, please visit the website of Murata at the following URL:
http://www.murata.com
Note: The pass criteron of the above test is as follows:
Solder bath temperature = 230 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Solder bath temperature = 245 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
C
1) High-frequency Oscillation
1
XIN
Solderability rate until forming ≥ 95 %
XOUT
C
2
Page 255
C
2) Low-frequency Oscillation
XTIN
1
XTOUT
C
2
TMP86FS28DFG