C8051F930-GQ Silicon Laboratories Inc, C8051F930-GQ Datasheet - Page 115

IC 8051 MCU 64K FLASH 32-LQFP

C8051F930-GQ

Manufacturer Part Number
C8051F930-GQ
Description
IC 8051 MCU 64K FLASH 32-LQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F9xxr
Datasheets

Specifications of C8051F930-GQ

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
32-LQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
24
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 23x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F9x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4.25 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F930DK
Minimum Operating Temperature
- 40 C
On-chip Adc
23-ch x 10-bit
No. Of I/o's
24
Ram Memory Size
4KB
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1478 - PLATFORM PROG TOOLSTCK F920,F930336-1477 - PLATFORM PROG TOOLSTCK F920,F930336-1473 - KIT DEV C8051F920,F921,F930,F931336-1472 - BOARD TARGET/PROTO W/C8051F930
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1466

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F930-GQ
Manufacturer:
SILICON
Quantity:
3 500
Part Number:
C8051F930-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F930-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F930-GQR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
10.4. Multiplexed External Memory Interface
For a Multiplexed external memory interface, the Data Bus and the lower 8-bits of the Address Bus share
the same Port pins: AD[7:0]. For most devices with an 8-bit interface, the upper address bits are not used
and can be used as GPIO if the external memory interface is used in 8-bit non-banked mode. If the
external memory interface is used in 8-bit banked mode, or 16-bit mode, then the address pins will be
driven with the upper 4 address bits and cannot be used as GPIO.
Many devices with a slave parallel memory interface, such as SRAM chips, only support a non-multiplexed
memory bus. When interfacing to such a device, an external latch (74HC373 or equivalent logic gate) can
be used to hold the lower 8-bits of the RAM address during the second half of the memory cycle when the
address/data bus contains data. The external latch, controlled by the ALE (Address Latch Enable) signal,
is automatically driven by the External Memory Interface logic. An example SRAM interface showing
multiplexed to non-multiplexed conversion is shown in Figure 10.2.
This example is showing that the external MOVX operation can be broken into two phases delineated by
the state of the ALE signal. During the first phase, ALE is high and the lower 8-bits of the Address Bus are
presented to AD[7:0]. During this phase, the address latch is configured such that the Q outputs reflect the
states of the D inputs. When ALE falls, signaling the beginning of the second phase, the address latch
outputs remain fixed and are no longer dependent on the latch inputs. Later in the second phase, the Data
Bus controls the state of the AD[7:0] port at the time RD or WR is asserted.
See Section “10.6. External Memory Interface Timing” on page 118 for detailed timing diagrams.
I
E
F
M
AD[7:0]
A[11:8]
Figure 10.1. Multiplexed Configuration Example
ALE
WR
RD
ADDRESS BUS (12-bit or 8-bit)
DATA BUS
Rev. 1.1
GPIO (4-bit)
(Optional)
C8051F93x-C8051F92x
V
DD
8
CS
RD
WR
ALE
AD[7:0]
(8-bit Interface)
LEDs/Switches
Controller
Ethernet
115

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