C8051F930-GQ Silicon Laboratories Inc, C8051F930-GQ Datasheet - Page 28

IC 8051 MCU 64K FLASH 32-LQFP

C8051F930-GQ

Manufacturer Part Number
C8051F930-GQ
Description
IC 8051 MCU 64K FLASH 32-LQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F9xxr
Datasheets

Specifications of C8051F930-GQ

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
32-LQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
24
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 23x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F9x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4.25 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F930DK
Minimum Operating Temperature
- 40 C
On-chip Adc
23-ch x 10-bit
No. Of I/o's
24
Ram Memory Size
4KB
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1478 - PLATFORM PROG TOOLSTCK F920,F930336-1477 - PLATFORM PROG TOOLSTCK F920,F930336-1473 - KIT DEV C8051F920,F921,F930,F931336-1472 - BOARD TARGET/PROTO W/C8051F930
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1466

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F930-GQ
Manufacturer:
SILICON
Quantity:
3 500
Part Number:
C8051F930-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F930-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F930-GQR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
C8051F93x-C8051F92x
3.
28
*Note: Available only on the C8051F920/30.
XTAL3
XTAL4
DCEN
Name
C2CK
DC– /
VBAT
V
P2.7/
GND
GND
RST/
DC+
C2D
Pinout and Package Definitions
DD
/
‘F920/30 ‘F921/31
Table 3.1. Pin Definitions for the C8051F92x-C8051F93x
Pin Numbers
10
5
3
1
2
4
6
7
9
5
3
1
2
4
6
7
9
8
P Out
A Out
D I/O
D I/O
D I/O
D I/O
Type
P In
P In
P In
P In
A In
G
G
G
Description
Battery Supply Voltage. Must be 0.9 to 1.8 V in single-cell
battery mode and 1.8 to 3.6 V in dual-cell battery mode.
Power Supply Voltage. Must be 1.8 to 3.6 V. This supply
voltage is not required in low power sleep mode. This
voltage must always be > VBAT.
Positive output of the dc-dc converter. In single-cell battery
mode, a 1uF ceramic capacitor is required between DC+
and DC–. This pin can supply power to external devices
when operating in single-cell battery mode.
DC-DC converter return current path. In single-cell battery
mode, this pin is typically not connected to ground.
In dual-cell battery mode, this pin must be connected
directly to ground.
Required Ground.
DC-DC Enable Pin. In single-cell battery mode, this pin
must be connected to VBAT through a 0.68 µH inductor.
In dual-cell battery mode, this pin must be connected
directly to ground.
Device Reset. Open-drain output of internal POR or V
monitor. An external source can initiate a system reset by
driving this pin low for at least 15 µs. A 1 k to 5 k pullup
to V
complete description.
Clock signal for the C2 Debug Interface.
Port 2.7. This pin can only be used as GPIO. The Crossbar
cannot route signals to this pin and it cannot be configured
as an analog input. See Port I/O Section for a complete
description.
Bi-directional data signal for the C2 Debug Interface.
SmaRTClock Oscillator Crystal Input.
See Section 20 for a complete description.
SmaRTClock Oscillator Crystal Output.
See Section 20 for a complete description.
Rev. 1.1
DD
is recommended. See Reset Sources Section for a
DD

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